ALISO VIEJO, Calif., May 21, 2013 /PRNewswire/ -- Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced shipment of production-qualified SmartFusion®2 system-on-chip (SoC) field programmable gate arrays (FPGAs). The company also announced the availability of its full-featured SmartFusion2 development kit with support for mainstream industry interfaces.
Since the SmartFusion2 introduction in October 2012, Microsemi has engaged with over 400 customers worldwide, and the device family has been adopted into numerous customer systems in the communications, industrial and defense markets. Microsemi's lead customer program, coupled with the early availability of SoC development tools and now production-qualified devices and a development kit, enables customers to ramp to manufacturing volumes in a timely manner.
"With scores of active customer engagements, it is gratifying to note that more than 30 percent of these are new customers that have never used Microsemi FPGAs before, validating our strategy to provide differentiated FPGA-based SoCs for the marketplace," said Paul Ekas, vice president of marketing for Microsemi. "Customers seeking to design with mainstream FPGA features, including high-speed SERDES, DDR3 memory controllers and integrated math blocks, can now do so on the industry's lowest power, most secure and SEU-immune SoC FPGA."
"HMS is delighted that SmartFusion2 has gone into volume production. The SmartFusion2 SoC FPGAs provide an ideal secure and flash-based programmable system-on-chip platform that addresses our existing customer requirements and tomorrow's expectations," said Staffan Dahlstrӧm, CEO, HMS Networks. "The combination of a non-volatile FPGA that does not require an external boot device and a compact, low-power ARM® Cortex™ M3 processor is ideal for our small form-factor industrial networking systems. Moreover, the built-in security features of these FPGAs will prove to be useful for future customers who are building highly secure versions of these systems. We look forward to continuing the strategic relationship we have with Microsemi and will continue to build on SmartFusion2 SoC FPGAs as a key element in our solutions for demanding industrial network applications."
Designers of safety-critical, industrial networking and high availability communications systems now no longer have to compromise between mainstream features and the added benefits of superior reliability and security that SmartFusion2 SoC FPGAs provide. The production silicon is available with a complete ecosystem of software, IP and design kits that enable customers to deploy low-risk solutions.
"The breadth and depth of Microsemi's product offering allowed us to integrate several of our industry-leading devices into the SmartFusion2 development board, and deliver a robust design solution that features programmability, embedded processors, timing solutions and PoE functionality all in one platform," said Ekas. "As a result of our system solution approach, product architects have the flexibility of using a single, cost-effective and high-performance design platform for multiple products."
SmartFusion2 Development Kit Features
- SmartFusion2 M2S050T-FGG896 SoC FPGA
- 56K logic element, 256Kbit eNVM, 1.5Mbit SRAM and additional distributed SRAM in the FPGA fabric
- External SDRAM memory controller
- Peripherals include triple-speed Ethernet, USB 2.0, SPI, CAN, DMAs, I2Cs, UARTs and timers
- 16 x 5Gbps SERDES (can be evaluated through SMP connectors,) PCIe Gen2 x4 and XAUI/XGXS+ native SERDES
- Provides the most general purpose and 3.3V I/Os in the industry; ability to evaluate DDR and GPIO performance
- Build PCI Express® endpoint applications through the X4 PCIe Gen1/Gen2 edge fingers provided on the board
- IEEE 1588 and Synchronous Ethernet packet clock network synchronizer
- Features four independent clock channels, frequency, and phase sync over packet networks and physical layer equipment clocks synchronization
- PD70201 PoE
- Up to 47.7W of power
- Power supply module required: PD-9501G/AC (not supplied)
- Precision analog-to-digital converter (ADC)
- 16-bit, 500 kSPS, eight channel, single-ended for mixed signal power management
- 512 MB of DDR3 memory on-board
- 256 MB for ECC
- 16MB of SDRAM
- eMMC and 4GB NAND flash memory
- SPI flash and 8MB modules
The SmartFusion2 M2S050 and M2S050T devices are in full volume production and available for order now, with the remaining family members scheduled to begin shipping through the remainder of 2013 and early 2014. The SmartFusion2 development kit, part number SF2-DEV-KIT-PP, is available for US $1,800. For additional details on the development kit visit http://www.microsemi.com/soc/products/hardware/devkits_boards/smartfusion2_dev.aspx. For more information about Microsemi's SmartFusion2 SoC FPGAs, visit www.microsemi.com/smartfusion2, contact your local sales representative or email firstname.lastname@example.org.
About SmartFusion2 SoC FPGAs
Microsemi's SmartFusion2 SoC FPGAs are designed to address fundamental requirements for advanced security, high reliability and low power in critical communications, industrial, defense, aviation and medical applications. SmartFusion2 integrates inherently reliable flash-based FPGA fabric, a 166 megahertz (MHz) ARM Cortex-M3 processor, advanced security processing accelerators, DSP blocks, SRAM, eNVM and industry-required high-performance communication interfaces, all on a single chip.
About SmartFusion2 Development Kits
Designers can take advantage of the SmartFusion2 development kit to prototype highly integrated systems leveraging the SmartFusion2 SoC FPGA with Ethernet, PCI Express, USB, CAN and other transceiver interfaces. The RoHS-compliant kit includes Microsemi's cutting-edge IEEE 1588/Synchronous Ethernet clock synchronizer and PD70201 Power-over-Ethernet (PoE) controller, providing product developers with a full-featured solution for applications that encompass industrial motor control and networking, timing and synchronization, GbE/10GbE switching, mixed-signal power management, wireless backhaul, wireline access and more. An industry-standard fixed mobile convergence (FMC) connector is also included to enable Internet connectivity and use with third-party adaptor cards.
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance, radiation-hardened and highly reliable analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,000 employees globally. Learn more at www.microsemi.com.
Microsemi and the Microsemi logo are registered trademarks or service marks of Microsemi Corporation and/or its affiliates. Third-party trademarks and service marks mentioned herein are the property of their respective owners.
"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements related to its shipment of production-qualified SmartFusion2 and its full-featured SmartFusion2 development kit, and its potential effects on future business, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.
Source: Microsemi Corporation
SOURCE Microsemi Corporation