By increasing stage speed and optimizing control processes, the new Grade 6 productivity upgrade option reduces exposure process time and achieves the industry's highest-level2 throughput rate, 255 wafers per hour3, to respond to the needs of chip manufacturers seeking reduced cost of ownership.4 Additionally, by simply changing the process mode, the equipment can balance productivity and overlay performance levels to support chip manufacturing processes that require a variety of overlay accuracies.
The upgraded models inherit the same high reputation and reliability of the currently available FPA‑6300ES6a, to facilitate a smooth upgrade for models currently in operation. Additionally, downtime resulting from the upgrade process has been reduced, minimizing impact on production schedules.
For more information on Canon U.S.A. and its industrial products, please visit www.usa.canon.com/industrial.
About Canon U.S.A., Inc.
Canon U.S.A., Inc., is a leading provider of consumer, business-to-business, and industrial digital imaging solutions to the United States and to Latin America and the Caribbean (excluding Mexico) markets. With approximately $31 billion in global revenue, its parent company, Canon Inc. (NYSE: CAJ), ranks third overall in U.S. patents granted in 2015† and is one of Fortune Magazine's World's Most Admired Companies in 2016. Canon U.S.A. is committed to the highest level of customer satisfaction and loyalty, providing 100 percent U.S.-based consumer service and support for all of the products it distributes. Canon U.S.A. is dedicated to its Kyosei philosophy of social and environmental responsibility. In 2014, the Canon Americas Headquarters secured LEED® Gold certification, a recognition for the design, construction, operations and maintenance of high-performance green buildings. To keep apprised of the latest news from Canon U.S.A., sign up for the Company's RSS news feed by visiting www.usa.canon.com/rss and follow us on Twitter @CanonUSA. For media inquiries, please contact firstname.lastname@example.org.
†Based on weekly patent counts issued by United States Patent and Trademark Office.
1 A semiconductor lithography system that utilizes a 248 nm exposure wavelength laser generated by combining the noble gas krypton (Kr) and the halogen gas fluoride (F).
2 Among same-class KrF scanners. As of December 14, 2016, based on a Canon survey of published specifications.
3 The amount of 300m wafers exposed in one hour at 98 shots per wafer.
4 One indicator of the productivity of processes and production equipment for semiconductor mass production lines.
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SOURCE Canon U.S.A., Inc.