New Series of Load Switch ICs from Toshiba Now Available Ultra-Small Packaging Ideal for Applications Requiring High-Density Board Assembly - Including Mobile Devices

IRVINE, Calif., April 24, 2013 /PRNewswire/ -- Toshiba America Electronic Components, Inc., (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announced the availability of a new lineup of load switch ICs for mobile devices. Featuring Toshiba's newly developed micro CMOS process, the new lineup features low voltage operation and low ON-resistance characteristics – in ultra-small packages.

The TCK101G and TCK102G are low consumption current load switch ICs with slew rate control driver for power management. Featuring low voltage operation at 1.1V and a low ON-resistance characteristics of 55m ohms (typ.) (VIN = 3.3V, IOUT = 500mA) in a 0.4mm pitch ultrasmall WCSP6 (0.8mm x 1.2mm, t: 0.64mm (max.)) package, these ICs come standard with an inrush current limiter and overtemperature protection circuit. An output auto-discharge function is also available. Toshiba's new lineup of 200mA output LDO regulators control inrush current, making them suitable for a wide range of applications including mobile phones, portable audio players, notebook PCs, DSC/DVC, and other small mobile devices.

Toshiba's TCK104G and TCK105G are load switch ICs for power management and current limit function featuring wide input voltage operation from 1.1 to 5.5V. They feature low switch ON- resistance at 65m ohms typical at 3.3V, 700mA load condition and a slew rate control driver, with thermal shutdown and an output auto-discharge function. Output current type is available, simplifying device selection and design. Available in a 0.4mm pitch ultra small package WCSP6 (0.8mm x 1.2mm x 0.64mm (max)), these devices are ideal for portable applications that require high-density board assembly – including mobile phones.

Toshiba is also offering the TCK106G, TCK107G and TCK108G which are available in the ultra-small WCSP4 package with a 0.64mm 2 footprint.  

According to Talayeh Saderi, senior business development engineer for TAEC, "Mobile devices continue to get lighter and thinner, with designers adding more and more powerful functionalities. System designers looking to accomplish all of this - while at the same time extending battery life and meeting high-density board requirements – will find Toshiba's new load switch power management ICs fit the bill perfectly."

Features include:

  • Wide input voltage operation: VIN = 1.1 to 5.5V
  • Low ON-resistance
  • Low quiescent current:
  • Low standby current: IQ(OFF) = 0.1 microamperes (typ) in stand-by mode
  • Inrush current reducing circuit
  • Thermal shutdown function
  • Auto-discharge available  
  • Pull down connection between CONTROL and GND
  • Ultra small package: WCSP6B (0.8mm x 1.2mm x 0.64mm(max))          
                                   WCSP4 (0.79mm x .79mm x 0.5mm(typ))

Part number

Package

Output current (Max)

Function

TCK101G

WCSP6B

500mA

Inrush current limiter, Over temperature protection circuit, Output discharge

TCK102G

WCSP6B

500mA

Inrush current limiter, Over temperature protection circuit

TCK104G

WCSP6B

500mA

Overcurrent protection, Over temperature protection

TCK105G

WCSP6B

800mA

Inrush current limiter, Output discharge

TCK106G

WCSP4

1.0A

Inrush current limiter, active high

TCK107G

WCSP4

1.0A

Inrush current limiter, auto-discharge, active high

TCK108G

WCSP4

1.0A

Inrush current limiter, auto-discharge, active low

Pricing and Availability
Toshiba's lineup of load switch ICs is currently available. For datasheets and samples, please contact your Toshiba representative.

*About Toshiba Corp. and TAEC

About TAEC
Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), discrete devices, advanced materials, medical tubes, custom SoCs/ASICs, imaging products, microcontrollers and wireless components that make possible today's leading smartphones, tablets, cameras, medical devices, automotive electronics, enterprise solutions and more.

Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's fifth largest semiconductor manufacturer (Gartner, 2012 Worldwide Semiconductor Revenue, April, 2013). Toshiba Corporation was founded in 1875 and today has over 554 subsidiaries and affiliates, with 210,000 employees worldwide. Visit Toshiba's web site at www.toshiba.co.jp/index.htm.

© 2013 Toshiba America Electronic Components, Inc. All rights reserved.
Information in this press release, including product pricing and specifications, content of services and contact information,  is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice.  Technical and application information contained here is subject to the most recent applicable Toshiba product specifications.

Editor's Note:  Images available for download from: http://www.toshiba.com/taec/news/press_releases/2013/powr_13_674.jsp

AGENCY CONTACT:
Dena Jacobson
Lages & Associates
Tel.: (949) 453-8080
dena@lages.com

SOURCE Toshiba America Electronic Components, Inc.



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