SAN DIEGO, Sept. 3, 2013 /PRNewswire/ -- UPLINQ -- Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announces the addition of a new device to its Camera Serial Interface Converter (CSI) chipset family, High Definition Multimedia Interface (HDMI®) to Mobile Industry Processor Interface (MIPI®). The TC358749XBG device for the first time enables an HDMI video stream to be recognized and read directly by an application processor in a mobile device. This streamlined, industry first approach not only improves video processing and system performance, it gives smartphone manufacturers a quick path to other application areas without having to perform time-consuming processor re-designs.
The TC358749XBG is a follow-on part to the TAEC TC358743XBG adding video de-interlacing, video scaling, video format conversion and MIPI SLIMbus® audio support. With its new LSI front end video processing, de-interlacing and scaling, the TC358749XBG significantly reduces the memory bandwidth and video processing requirements on the host processor.
The new device converts an HDMI video stream into a MIPI CSI-2 video stream which is a format recognized by application processors. An HDMI audio stream is also supported and can be transmitted over I2S, TDM, S/PDIF, or the MIPI SLIMbus. Any one of these four configurable audio interfaces with video up-down scaling and color space conversion offers additional options for the application processor to accept video in a suitable format to match the desired display panel output resolutions for many consumer electronics applications.
"Toshiba is the only company to offer a chipset that can convert an HDMI video stream, received by smart monitors, smart set-top boxes, smart TVs, etc., to a CSI-2 video interface able to be recognized by the host processor," says Deepak Prakash, senior director for the Logic LSI Business Unit, System LSI Group at TAEC. "The ability of the TC358749XBG to make the HDMI interface look like a camera interface extends the reach of the smartphone processor and opens up many opportunities for manufacturers to pursue."
The Toshiba TC358749XBG is an 80-pin device that comes in a small-size package size, 7.0 mm x 7.0 mm, with 0.65 mm ball pitch. The device is designed with clock and power management circuitry to support low-power states.
Pricing and Availability
Sample pricing for the TC358749XBG device is $5.00 (U.S.). Sample shipments are currently available with mass production scheduled for December, 2013.
Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), solid state hybrid drives (SSHDs), discrete devices, advanced materials, medical tubes, custom SoCs/ASICs, imaging products, microcontrollers and wireless components that make possible today's leading smartphones, tablets, cameras, medical devices, automotive electronics, enterprise solutions and more.
Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's fifth largest semiconductor manufacturer (Gartner, 2012 Worldwide Semiconductor Revenue, April, 2013). Toshiba Corporation was founded in 1875 and today has over 554 subsidiaries and affiliates, with 210,000 employees worldwide. Visit Toshiba's web site at www.toshiba.co.jp/index.htm.
Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba's "Handling Guide for Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook." This information is available at http://www.toshiba.com/taec/support/techquestions/index.jsp or from your TAEC representative.
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SOURCE Toshiba America Electronic Components (TAEC)