ESPOO, Finland, July 3, 2014 /PRNewswire/ --
Picosun Oy, the leading manufacturer of high quality Atomic Layer Deposition (ALD) equipment for global industries, presents a range of novel metallization processes for electronics industry.
The trend towards more and more compact and miniaturized electronics has forced the manufacturers to invent new methods for packing, stacking, and connecting the active components. Instead of the more traditional horizontal geometry, so-called three-dimensional integrated circuits (IC) and modules in which the components are stacked vertically on top of each other enable denser and more integrated device architecture. This enables continued scaling of technology nodes, faster and more powerful devices, and saves the valuable physical space inside constrained environments such as smartphones and other personal mobile equipment, thus realizing even more versatile and multifunctional end products.
Picosun's now developed metallization processes enable several critical applications of the electronics industry such as diffusion barriers, adhesion and seed layers for interconnects, capacitor electrodes for memories, gate metals for logic devices, and TSV (Through-Silicon-Via) structures for 3D packaging.
"We are pleased to announce these novel processes, developed in collaboration between Picosun and our customers. During the past 20 years of ALD development I've come to known the immense industrial relevancy of these processes. These metallization processes will be a yet new essential asset for Picosun as a leading solution provider for today's and tomorrow's IC industries," states Dr. Wei-Min Li, Applications Director of Picosun and the CEO of Picosun Asia, after his invited speech at the AVS ALD 2014 conference in Kyoto, Japan in June.
Picosun's highest level ALD thin film technology enables the industrial leap into the future by novel, cutting-edge coating solutions, with four decades of continuous, groundbreaking expertise in the field. Today, PICOSUN™ ALD systems are in daily production use in numerous major industries around the world. Picosun is based in Finland, with subsidiaries in USA, China, and Singapore, and a world-wide sales and support network.
Dr. Wei-Min Li, Applications Director (email email@example.com; tel. +358-50-321-1955)
SOURCE Picosun Oy