DUBLIN, Ireland, April 14, 2014 /PRNewswire/ --
Research and Markets (http://www.researchandmarkets.com/research/shqt3b/plasma_etching) has announced the addition of the "Plasma Etching: Market Analysis and Strategic Issues" report to their offering.
(Logo: http://photos.prnewswire.com/prnh/20130307/600769 )
The future needs in plasma etching will be for ever tighter control of process variability, higher selectivity and less damage. This report addresses the strategic issues impacting both the user and supplier of plasma etching equipment to the semiconductor industry.
Markets for dry etching and stripping are analyzed and projected.
Key Topics Covered:
Chapter 1 Introduction
1.1 The Need For This Report
Chapter 2 Executive Summary
2.1 Summary of Technical Issues
2.2 Summary of User Issues
2.3 Summary of Supplier Issues
2.4 Summary of Market Forecasts
Chapter 3 Technical Issues and Trends
3.1 Introduction
3.2 Processing Issues
3.2.1 Chlorine Versus Fluorine Processes
3.2.2 Multilevel Structures
3.2.3 New Materials
3.2.4 GaAs Processing
3.3 Plasma Stripping
3.3.1 Photoresist Stripping
3.3.2 Low-K Removal
3.4 Safety Issues
3.4.1 System Design Considerations
3.4.2 Gas Handling
3.4.3 Reactor Cleaning
Chapter 4 Market Forecast
4.1 Influence of Technology Trends on the Equipment Market
4.2 Market Forecast Assumptions
4.3 Market Forecast
Chapter 5 Strategic Issues: Users
5.1 Evaluating User Needs
5.1.1 Device Architecture
5.1.2 Wafer Starts and Throughput Requirements
5.1.3 Wafer Size
5.2 Benchmarking a Vendor
5.2.1 Pricing
5.2.2 Vendor Commitment and Attitudes
5.2.3 Vendor Capabilities
5.2.4 System Capabilities
5.3 Cost Analysis
5.3.1 Equipment Price
5.3.2 Installation Costs
5.3.3 Maintenance Costs
5.3.4 Sustaining Costs
5.3.5 Hidden Costs
5.4 User - Supplier Synergy
5.4.1 Feedback During Equipment Evaluation
5.4.2 Feedback During Device Production
Chapter 6 Strategic Issues: Suppliers
6.1 Competition
6.2 Customer Interaction
6.2.1 Customer Support
6.2.2 Cleanroom Needs in the Applications Lab
6.3 Equipment Compatibility in Class 1 Cleanrooms
6.3.1 Footprint Versus Serviceability
6.3.2 Particulate Generation
6.3.3 Automation
6.3.4 300-mm Tools
For more information visit http://www.researchandmarkets.com/research/shqt3b/plasma_etching
Media Contact: Laura Wood , +353-1-481-1716, [email protected]
SOURCE Research and Markets
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