Qualcomm's VIVE QCA9500 High Density WiGig/WiFi 802.11ad Chipset for the 60 GHz Band Teardown Report 2018

DUBLIN, March 12, 2018 /PRNewswire/ --

The "Qualcomm VIVE® QCA9500 High Density WiGig/WiFi 802.11ad Chipset for the 60 GHz Band Complete Teardown Report" report has been added to ResearchAndMarkets.com's offering.

This report includes a full investigation of the module, featuring a detailed study of the SiP and the antenna board including die analyses, processes and board cross-sections. Finally, it contains a complete cost analysis and a selling price estimation of the system.

2018 will be a key milestone in the journey towards 5G communication. Several areas, from semiconductor to packaging, will improve their technologies to be suitable for 5G deployment. We now know that the 5G frequency will be in the millimeter wave (mmWave) range. In this band, the IEEE has already licensed a Wifi 802.11 protocol, known as WiGig. Using 7 GHz of bandwidth in the 60 GHz band, it allows gigabit data-rates similar to wired communication.

Only two main players share this upcoming market, Intel and Qualcomm. And as a pioneer in 5G development, Qualcomm is now offering a WiGig chipset. It provides an early glimpse of 5G mobile user experiences and technologies using an innovative System in Package (SiP) approach in the VIVE QCA9500.

This complete solution serves both mobile computer devices and access points, specifically routers. The module comes with two boards linked by a coaxial connection. The first board features a radio frequency integrated circuit (RFIC) and innovative antennae, and the second features an advanced SiP with a double sided molding configuration. The SiP integrates a baseband (BB) processor along with a switch, a regulator, a crystal, memory and more than 60 surface mounted device (SMD) components, all in a single package smaller than 40 mm. This is the first double side molded device we found in the market, and it could be a key milestone for 5G SiP technology.

Developed by Wilocity, which has been a Qualcomm subsidiary since 2014, the RFIC features up to four transceivers controlling up to 32 antennas, both patch and quasi-Yagi-type, for the beamforming at 60 GHz. The SiP uses non-conventional molded packaging developed by Amkor.

It has innovative interconnections, enabling the redistribution of the BB processor signal to the printed circuit board (PCB). Copper pillars inside the molding and a very thin confined PCB substrate complete the signal distribution structure.

Key Topics Covered:

1. Overview / Introduction

2. Company profile & WiGig technology

3. TP-LINK Talon AD7200 Teardown

4. Physical Analysis
Physical analysis methodology
Module analysis
Module view and dimensions
Module marking and block diagram
Baseband board analysis
Board disassembly
Board bill of material
Board cross-section
Baseband SiP analysis
Package view and dimensions
Package opening: Copper pillar, bill of material
Package cross-section: PCB, copper pillar, dimensions
Package process analysis
Die analysis: Baseband processor, switch, regulator, memory
Die view and dimensions
Die cross-section
Die process
Physical analysis comparison
SiP vs discrete
Antenna board analysis
Board disassembly
Board bill of material
Board cross-section
Die analysis: RFIC
Die view and dimensions
Die cross-section
Die process

5. Manufacturing process flow
Die fabrication unit: Baseband processor, RFIC
Packaging fabrication unit
SiP package process flow

6. Cost analysis
Overview of the cost analysis
Supply chain description
Yield hypotheses
Die cost analyses: Baseband processor, RFIC
Front-end cost
Wafers and die costs
SiP Package cost analysis
SiP Front-end cost
SiP Cost by process step
Final test cost
Final assembly
Component cost

Companies Mentioned

• Amkor
• Intel
• Qualcomm
• Wilocity

For more information about this report visit https://www.researchandmarkets.com/research/93k8mb/qualcomms_vive?w=5

Media Contact:

Research and Markets
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[email protected]

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