FARMINGTON, Conn., Oct. 18, 2012 /PRNewswire-iReach/ -- "Reverse-cost analysis" is the process of disassembling a device into its component parts in order to identify the core technology within and calculate the cost to manufacture the device. The results of these studies can be used to pre-analyze the cost of potentially expensive projects at a Research and Development level, to enhance the negotiation power of purchasing managers, and to benchmark competitors' products.
Texas Instrument DLP Pico (MT) projector family: DLP nHD, DLP 0.3 WVGA, DLP 0.17 HVGA Reverse Costing Analysis
SystemPlus Consulting's October 2012 reverse costing report on Texas Instrument's DLPR Pico projector devices offers a detailed teardown of three Texas Instrument DLP chipsets.
This report provides complete teardown of three Texas Instrument DLPR pico projectors (DLPR nHD, DLPR 0.17 HVGA and the DLPR 0.3 WVGA) with sections offering detailed photos, material analysis, schematic assembly description, manufacturing process flow, in-depth economical analysis, manufacturing cost breakdown, and selling price estimation.
An Executive Summary for this report and free sample pages from the full document are available at http://www.giiresearch.com/report/spc251863-texas-instrument-dlp-pico-mt-projector-family-dlp.html
Bosch Sensortec BMC050 6-axis Electronic Compass Reverse Costing Analysis
The Bosch BMC050 is ideally suited for mobile phones, tablet PCs and notebooks. It features high sensitivity of 0.3 µtesla and low power consumption at 0.54 milliamps. This report provides complete teardown of the Bosch BMC050 E-compass with detailed photos; material analysis; schematic assembly description; manufacturing process flow; in-depth economical analysis; manufacturing cost breakdown; and selling price estimation.
An Executive Summary for this report and free sample pages from the full document are available at http://www.giiresearch.com/report/spc249576-bosch-sensortec-bmc050-6-axis-electronic-compass.html
STMicroelectronics LSM330D 6-Axis Inertial Module 3D Accelerometer & 3D Gyroscope Reverse Costing Analysis
SystemPlus Consulting has also published their reverse cost report of STMicroelectronics' LSM330D, a system-in-package featuring a 3-axis accelerometer and a 3-axis gyroscope. With a 3x5.5x1mm size, the LSM330D 6-Axis inertial Module 3D Accelerometer belongs to the smallest inertial modules for consumer applications. It is manufactured with the same ST THELMA process used for more than 1.5billon MEMS devices. The LSM330D is targeted for consumer applications: GPS navigation systems, Impact recognition and logging, Gaming, and more.
An Executive Summary for this report and free sample pages from the full document are available at http://www.giiresearch.com/report/spc248632-stmicroelectronics-lsm330d-6-axis-inertial-module.html
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