Reverse Costing Analysis of STMicroelectronics's A3G4250D Automotive 3-Axis MEMS Gyroscope
DUBLIN, Feb .17, 2015 /PRNewswire/ --Research and Markets
(http://www.researchandmarkets.com/research/pxqlp2/stmicroelectronics) has announced the addition of the "STMicroelectronics A3G4250D Automotive 3-Axis MEMS Gyroscope - Reverse Costing Analysis" report to their offering.
MEMS are getting broadly adopted in the automotive industry and non-safety applications like in-dash navigation are now requiring low-cost and small footprint components.
The A3G4250D is a low power consumption MEMS gyroscope which is the first 3-axis gyroscope to have met the industry-standard qualification for automotive integrated circuits (AEC-Q100).
STMicroelectronics 3-axis gyroscope for automotive applications measures angular rates up to ±245 dps and has been designed and produced using the same manufacturing process (THELMA) than ST consumer products.
Assembled in a 4.0 x 4.0 x 1.1mm package, it embeds an 8-bit temperature sensor and operates within an extended temperature range from -40 to 85°C.
It is suitable for applications including in-dash navigation, telematics and vehicle tolling systems, motion control with MMI (man-machine interface), appliances and robotics.
Key Topics Covered:
1. Overview / Introduction
2. Company Profile
- STMicroelectronics
- A3G4250D Characteristics
3. Physical Analysis
- Synthesis of the Physical Analysis
- Physical Analysis Methodology
- Package
- Package Views & Dimensions
- Package Pin Out
- Package Opening
- Wire Bonding Process
- Package Cross-Section
- ASIC Die 30
- View, Dimensions & Marking
- Delayering
- Main Blocks Identification
- Cross-Section
- Process Characteristics
- MEMS Die 43
- View, Dimensions & Marking
- Bond Pad Opening
- Cap Removed & Cap Details
- Sensing Area Details
- Cross-Section (Sensor, Cap & Sealing)
- Process Characteristics
4. Manufacturing Process Flow
- Global Overview
- ASIC Front-End Process
- ASIC Wafer Fabrication Unit
- MEMS Process Flow
- MEMS Wafer Fabrication Unit
- Packaging Process Flow
- Package Assembly Unit
5. Cost Analysis
- Main steps of economic analysis
- Yields Hypotheses
- ASIC Front-End Cost
- ASIC Back-End 0 : Probe Test & Dicing
- ASIC Wafer & Die Cost- MEMS Front-End Cost
- MEMS Back-End 0 : Probe Test & Dicing
- MEMS Front-End Cost per process steps
- MEMS Front-End: Equipment Cost per Family
- MEMS Front-End: Material Cost per Family
- MEMS Wafer & Die Cost- Back-End : Packaging Cost
- Back-End : Packaging Cost per Process Steps
- Back-End : Final Test Cost- MAX21000 Component Cost- Consumer 3-Axis Gyro Cost Comparison
6. Estimated Price Analysis
- Manufacturer Financial Ratios
- Estimated Selling Price
For more information visit http://www.researchandmarkets.com/research/pxqlp2/stmicroelectronics
Media Contact: Laura Wood , +353-1-481-1716, [email protected]
SOURCE Research and Markets
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