Reverse Costing Analysis of STMicroelectronics's HTS221 Humidity Sensor

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Sep 28, 2015, 10:10 ET

DUBLIN, Sept. 28, 2015 /PRNewswire/ --

Research and Markets (http://www.researchandmarkets.com/research/g4vgrl/stmicroelectronics) has announced the addition of the "STMicroelectronics HTS221 - Reverse Costing Analysis" report to their offering.

The HTS221 humidity sensor is the first environment sensor from STMicroelectronics which follows the train of new open cavity combos. Assembled in a 6-pins LGA 2 x 2 x 0.9mm package; the HTS221 is a digital humidity and temperature sensor equipped with a sensor die and an ASIC. It has operating ranges of -40+125°C, 0100 % relative humidity for 16bit output data for temperature and humidity.

The relative humidity sensor uses a polymer dielectric planar capacitor digital measurement technology which allows a precise response in very compact size. The integrated heater allows a high ODR.

This device uses a new type of package built around an original holed cap developed by STMicroelectronics for mobile phones and for industrial application with a temperature range from -40 °C to +120 °C.

The report presents deep technology and cost analysis of HTS221 with an exhaustive package analysis. It also includes a technology and production cost comparison with Bosch BME280 humidity and pressure sensor and with Sensirion SHTC1 humidity MEMS.

Key Topics Covered:

1. Glossary

2. Overview/Introduction, Companies Profile

3. Physical Analysis

4.Package
- Package Views & Dimensions
- Package Opening
- Wire bonding Process
- Package Cross-Section

5. ASIC Die
- View, Dimensions & Marking
- ASIC Delayering
- ASIC main blocks identification
- ASIC Process
- ASIC Die Cross-Section

6. Pressure & Humidity Die
- View, Dimensions & Marking
- MEMS Humidity Sensing Area
- Cap
- MEMS Humidity Cross-Section
- MEMS processes

7.Comparison with Bosch BME280 and Sensirion SCHTC1 pressure sensor

8. Manufacturing Process Flow

9. ASIC Front-End Process
- MEMS humidity Process Flow
- Wafer Fabrication Units
- Packaging Process Flow & Assembly Unit

10. Cost Analysis

11. Main steps of economic analysis
- Yields Hypotheses
- ASIC Front-End Cost
- ASIC Back-End 0 : Probe Test & Dicing
- ASIC Front-End Cost
- MEMS HumidityWafer & Die Cost
- MEMS HumidityFront-End Cost
- MEMS Humidity Back-End 0 : Probe Test & Dicing
- Back-End : Packaging Cost
- Back-End : Packaging Cost per Process Steps
- Back-End : Final Test Cost
- BME280 Component Cost

12. Estimated Price Analysis

For more information visit http://www.researchandmarkets.com/research/g4vgrl/stmicroelectronics