Samsung Galaxy S6 - Reverse Technology Report with Teardown & Physical Analysis of Key Components

Nov 03, 2015, 05:10 ET from Research and Markets

DUBLIN, Nov. 03, 2015 /PRNewswire/ --

Research and Markets (http://www.researchandmarkets.com/research/msvkzb/samsung_galaxy_s6) has announced the addition of the "Samsung Galaxy S6 Teardown & Physical Analyses of Key Components - Reverse Technology Report" report to their offering.

The Samsung Galaxy S6 holds many IC components which are listed and reviewed in the report. A special focus has been made to highlight the component structure and understand the manufacturing process on 11 notable components among 4 selected topics: Advanced packaging, MEMS/Sensor, RF and Imaging.

Five MEMS/Sensors components

  • Fingerprint sensor - second generation
  • eCompass - new reference which has never been used in a smartphone and smallest eCompass on the market
  • OIS gyroscope - smallest gyroscope on the market
  • Heart-rate monitor sensor and color, ambient light and proximity sensor - rarely integrated in a smartphone

Imaging components

  • Front and rear camera modules as well as flash LED

Two packaging components

  • Samsung Exynos Processor - advanced Package-on-Package (PoP) structure
  • Samsung power management IC - smallest pitch Wafer-Level Package (WLP) on the board

One RF component

  • Wi-Fi & Bluetooth combo module - flip-chip BGA SiP integrating the industry's most powerful 5G WiFi combo chip

Key Topics Covered:

1. Executive Summary
- High Resolution Pictures
- ICs Identification
- ICs Identification (mfr., ref., fcn., pkg. type, size & pin count)
- Unknown Components Decapsulation
- Repartition by package type
- Mfr. Design wins ranking
- ICs footprint ranking
- PCB Characteristics
- PCB Cross-Section
- PCB min. line width

2. Advanced Packaging
- Samsung Exynos PoP
- Package views & dimensions
- Package Cross-Section
- Package Opening
- Processor & DRAM dies measurement
- Samsung smallest pitch WLP
- Package views & dimensions
- Package Cross-Section

3. MEMS/Sensors
- Fingerprint Sensor
- Button Assembly View
- Fingerprint sensor views & dimensions
- Fingerprint sensor Cross-Section
- Sensor die measurement
- 3-Axis eCompass
- Package views & dimensions
- Package Cross-Section
- Die measurement
- Sensor Details
- OIS Gyroscope
- Assembly in camera module
- Package views & dimensions
- Package Opening & Die measurement
- MEMS opening & sensor details
- Cross-Section
- Pulse Oximetry & Heart-Rate Monitor Sensor
- Package views & dimensions
- Package Opening & Die measurement
- Color, ALS and Proximity Sensor
- Package views & dimensions
- Package Opening & Dies measurement

4. RF Devices
- 5G Wi-Fi & Bluetooth Combo Chip
- Package views & dimensions
- Package Opening & Dies measurement

5. Camera Modules & Flash LED
- 16Mp Rear Camera Module
- Module views & dimensions
- Module Opening & CIS die measurement
- Module Cross-Section
- 5Mp Front Camera Module
- Module views & dimensions
- Module Opening & CIS die measurement
- Module Cross-Section
- Flash LED
- Package views & dimensions
- Package Opening & LED die measurement

For more information visit http://www.researchandmarkets.com/research/msvkzb/samsung_galaxy_s6

Media Contact: Laura Wood , +353-1-481-1716, press@researchandmarkets.net

SOURCE Research and Markets



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