Semiconductor Packaging and Testing Industry Says SiP Technology to See Growth to 2015

Nov 09, 2015, 04:31 ET from RnR Market Research

PUNE, India, November 9, 2015 /PRNewswire/ --

Driven by the development of mobile devices, the worldwide (IC) semiconductor packaging and testing industry saw a significant growth in 2014. With leadership in technology and production capacity, the Taiwanese IC packaging and testing industry has enjoyed the highest growth in the world. As the availability of wearable devices and the IoT (Internet of Things) increases, new opportunities and challenges await the Taiwanese IC packaging and testing industry. This report recaps the recent development of the worldwide and Taiwanese IC packaging and testing industry while forecasting their developments in 2015 and beyond from the aspects of market trends and industrial structure.

Complete report on worldwide and taiwanese semiconductor packaging & testing industry spread across 16 pages, profiling 29 major companies and supported with tables and figures is now available at http://www.rnrmarketresearch.com/worldwide-and-taiwanese-semiconductor-packaging-testing-industry-2015-and-beyond-market-report.html.

And overview of the major trends in the worldwide and Taiwanese IC packaging and testing industries, including major vendors' rankings by revenue in 2014 and market share by region from 2012 to 2015. Also provided are shipment value forecasts of the worldwide and Taiwanese IC packaging and testing industries from 2015 to 2017. Provides highlights of the industry's future development; touching on vendors' capacity expansion activities from 2013 to present; growing demand for SiP technology due to wearable devices and IoT; and development of high-end heterogeneous packaging technologies.

Companies covered 

Amkor Technology, ASE, ASE Embedded Electronics Inc., Chipbond Technology, ChipMOS, FCI, Greatek Electronic, JCET, J-Device, Micron, Nepes, OCZ, Panasonic, Promos, PTI, Renesas, Samsung, SK Hynix, SMIC, SPIL, STATS ChipPAC, TDK, Tianshui Huatian Technology, Toshiba, TSMC, UTAC, Wuxi Tongzhi Microelectronics, Xilinx - Order Worldwide and Taiwanese Semiconductor Packaging & Testing Industry, 2015 and Beyond research report at http://www.rnrmarketresearch.com/contacts/purchase?rname=414909.

Another related report titled Global Die-level Packaging Equipment Market 2015-2019 forecast global die-level packaging equipment market to grow at a CAGR of 1.24% during 2014-2019. The key players in the global die-level packaging equipment market are ASM International NV, BE Semiconductor Industries N.V. (Besi), DISCO Corp., and Kulicke & Soffa Industries Inc. And the other prominent vendors in the market are Cohu, TOWA, Shinkawa, Advantest, and Hitachi High-Technologies.

The short replacement cycle of portable electronic devices is a key trend observed in this market. Frequent launches of next-version models render the current portable devices obsolete within a short period of time. This short lifespan will augment the demand for semiconductor wafers during the forecast period.

According to the report, steady growth of semiconductor wafer industry is a major driver that promotes growth in this market. The demand for semiconductor wafers is continually increasing owing to the augmented demand for portable electronic devices globally. Steady growth of semiconductor wafer industry.

Further, the report states that the increasing dependency on few key suppliers is a major challenge faced by this market. Inability of the raw material suppliers to provide resources on time negatively affects the business of semiconductor die-level packaging equipment manufacturers.

Explore more reports on the semiconductors market at http://www.rnrmarketresearch.com/reports/information-technology-telecommunication/electronics/semiconductors.

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