"We are grateful to Qualcomm Technologies for its consistent support. With its assistance, we have managed to set up an advanced 12-inch bumping line with stable and efficient production to offer mass production services to our customers," said Mr. Dong Cui, Chief Executive Officer of SJSemi. "The mass production of our 14nm wafer bumping technology is in recognition of our capabilities and strengths, and indicates our ability to offer comprehensive services to first-class global customers like Qualcomm Technologies. We expect to continuously keep pace with customer demand, further improve our technical capability, enrich our process methods, and boost our added value to the industrial chain."
"The 14nm bumping production from SJSemi is very important to Qualcomm Technologies and has begun mass production, which demonstrates SJSemi's world-class manufacturing capabilities in leading-edge bumping process technology," said Dr. Roawen Chen, Senior Vice President, QCT global operations, Qualcomm Technologies, Inc. "We are pleased to work with SJSemi to expand our semiconductor supply chain footprint in China, which further shows our commitment to support China's local IC manufacturing and better serve our Chinese customers."
Located in Jiangyin, Jiangsu province, SJSemi was founded in August 2014 through a joint venture between SMIC and Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET). SJSemi later received investment from China Integrated Circuit Industry Investment Fund Co., Ltd and Qualcomm Global Trading Pte Ltd., a subsidiary of Qualcomm Incorporated. Starting with the advanced 12-inch bumping and wafer testing, SJSemi aims to offer first-class Middle-End-Of-Line (MEOL) manufacturing and testing services and develop the advanced 3D IC business. It is committed to providing a convenient one-stop service to supply high quality and efficient chips for local and international customers, as well as help strengthen their global competitiveness.
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SOURCE Semiconductor Manufacturing International Corporation