System-in-Package (SiP) Technology Markets: 2018-2022 Global Strategic Business Report - Flip Chip Type of Interconnection Technology Leads SiP Technology Market

DUBLIN, July 12, 2018 /PRNewswire/ --

The "System-in-Package (SiP) Technology - Global Strategic Business Report" report has been added to ResearchAndMarkets.com's offering.

The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, and Rest of World. Annual estimates and forecasts are provided for the period 2015 through 2022. Also, a six-year historic analysis is provided for these markets.

This report analyzes the worldwide markets for System-in-Package (SiP) Technology in US$ Million.

The global market is further analyzed by:

Interconnection Technology

• Wire Bonding
• Flip-Chip

End-Use Sector

• Consumer Electronics
• Communications
• Aerospace & Defense
• Automotive
• Others

The report profiles 51 companies including many key and niche players such as:

• Amkor Technology, Inc. (USA)
• ASE Group (Taiwan)
• ChipMOS Technologies Inc. (Taiwan)
• Fujitsu Limited (Japan)
• GS Nanotech (Russia)
• Insight SiP (France)
• Intel Corporation (USA)
• Jiangsu Changjiang Electronics Technology Co. Ltd. (China)
• Kulicke & Soffa Pte Ltd. (Singapore)
• Nanium S.A. (Portugal)
• O.C.E. Technology Ltd. (Ireland)
• Powertech Technologies, Inc. (Taiwan)
• Renesas Electronics Corporation (Japan)
• Samsung Electronics Co., Ltd. (South Korea)
• ShunSin Technology (Zhongshan) Limited (China)
• Si2 Microsystems Private Limited (India)
• Siliconware Precision Industries Co. Ltd. (SPIL) (Taiwan)
• STATS ChipPAC Ltd. (Singapore)
• Unimicron Corporation (Taiwan)

Key Topics Covered

1. INDUSTRY OVERVIEW
Small Form Factor, High Performance & Energy Efficiency Needs of Electronics Industry Bolster Demand for System-in-Package (SiP) Technology
Growing Demand for Miniature and High Performance Electronic Devices & Systems Drive SiP Market
Developing Countries Offer Growth Prospects
Flip Chip Type of Interconnection Technology Leads SiP Technology Market
Consumer Electronics Sector Fuels Revenue Growth in SiP Market
Portable Electronic Devices Stir Demand for Flat Packaging
2.5D IC Packaging Technology Dominates SiP Market
Challenges Confronting the SiP Market

2. MARKET TRENDS & GROWTH DRIVERS
Importance of SiP Technology in Electronics
Rising Demand for High Performance and Compact Consumer Electronics Drive Growth
List of Select SiP Solutions for Connected Devices
Growing Demand for Smart, Energy Efficient Electronics Provides Business Case for SiP
Growing Sales of Smartphones Bode Well for SiP Market
Growing Demand for Tablet PCs
A Key Growth Driver
Applications in Set Top Boxes Boosts Demand for SiP Technology
Computing Devices
A Key Growth Driver
IoT Opens New Growth Avenues for SiP
TSVs for Die-to-Die/Die-to-Package Substrate Communication
Advanced Nodes Demand Innovative Package Technologies
PCB Considerations Vital for Using SiP in IoT Systems
WLCSP for Compact Form Factors
Trend Towards Smart Homes Offers Growth Opportunities
Miniaturization of Electronics
A Major Growth Driver for SiP
Need for Compact and High Speed Performance Products Spurs Market Growth
Shift in Direction towards More Than Moore's Law Benefits the SiP Market
SMBs Spur the Adoption of SiP
Expanding Applications in Non- Battery Operated Systems Spur Market Growth
SoC Design Complexities Bring Focus onto SiP
Combined SoC and SiP Technology Gains Increased Demand
Need to Reduce Cost Per Function of ICs Boosts Market Demand
Advanced SiP Packaging Transforming System-Level Integration Landscape
Wafer-Based Advanced SiP
Laminate-based Advanced SiP
SiP Technology to Impact Fan-In Packaging Platform
Foundries Focus on Offering Turnkey Services with System-in- Package
Vendors Offer Advanced Capabilities for SiP Design

3. TECHNOLOGY OVERVIEW

4. RECENT INDUSTRY ACTIVITY
Amkor Announces Product Qualification for SWIFT Packaging
3D Glass Solutions Collaborates with TE Connectivity
Silicon Labs Introduces New Bluetooth SiP Module
MediaTek Unveils SoCs for Fitness and Healthcare Devices
Intel Launches Intel Curie Module SiP
Octavo Systems Launches OSD3358 SiP Device
UTAC Collaborates with AT & S
MediaTek Unveils New SiP Chipsets
JCET Receives Order to Assemble SiP Modules for Apple

5. FOCUS ON SELECT GLOBAL PLAYERS
Amkor Technology, Inc. (USA)
ASE Group (Taiwan)
ChipMOS Technologies Inc. (Taiwan)
Fujitsu Limited (Japan)
GS Nanotech (Russia)
Insight SiP (France)
Intel Corporation (USA)
Jiangsu Changjiang Electronics Technology Co. Ltd. (China)
Kulicke & Soffa Pte Ltd. (Singapore)
Nanium S.A. (Portugal)
O.C.E. Technology Ltd. (Ireland)
Powertech Technologies, Inc. (Taiwan)
Renesas Electronics Corporation (Japan)
Samsung Electronics Co., Ltd. (South Korea)
ShunSin Technology (Zhongshan) Limited (China)
Si2 Microsystems Private Limited (India)
Siliconware Precision Industries Co. Ltd. (SPIL) (Taiwan)
STATS ChipPAC Ltd. (Singapore)
Unimicron Corporation (Taiwan)

6. GLOBAL MARKET PERSPECTIVE
 
Total Companies Profiled: 51 (including Divisions/Subsidiaries 53)

• The United States (16)
• Japan (3)
• Europe (8)
• France (4)
• Rest of Europe (4)
• Asia-Pacific (Excluding Japan) (25)
• Middle East (1)

For more information about this report visit https://www.researchandmarkets.com/research/433n9v/systeminpackage?w=5

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