SANTA CLARA, Calif., Feb. 28, 2017 /PRNewswire/ -- Thermal Engineering Associates' Bernie Siegal is working with a JEDEC committee to produce a THERMAL TEST CHIP GUIDELINE. Given the variety of test chips, mounting methods, and testing methods, JEDEC is attempting to provide a design guideline for thermal test chips used for integrated circuit (IC) package thermal characterization and investigations. A draft guideline has been produced and is being reviewed by members of the committee.
Thermal test chips have three primary purposes: 1) providing a well defined structure for the generation of heat flux, 2) using a well defined structure in a specific package for validating and calibrating thermal models, and 3) the thermal investigation of power topology mapping, power transient response and complex package assemblies.
The DRAFT version of the GUIDELINE provides for specific attachments such as wire bond or flip chip, differing thicknesses, areas, and topologies of test chips, sizes and locations of heating sources and thermal sensors, bump size and compositions and pad sizes, as well as redistribution layers and other such configurations.
The GUIDELINE also contains a table of required thermal measurement test conditions and a data parameter summary. The final guideline is likely to be approved and distributed by mid 2017.
About Thermal Engineering Associates:
TEA's president, Bernie Siegal, has been providing thermal test and measurement hardware, software, and consulting services since 1973. Siegal has been chairman of the JEDEC JC15 committee and is the principle author of many MILSTD 750 thermal test methods. All major semiconductor companies, packaging companies, and many system level OEMs have utilized TEA equipment and/or services during its long history. Siegal is a founding member of IEEE SEMI-THERM and has delivered numerous papers and articles on thermal testing, simulation, and evaluation methods and techniques and is frequently sought out as a lecturer and expert in the field. http://www.thermengr.net
SEE THERMAL ENGINEERING ASSOCIATES IN BOOTH 501 AT SEMI-THERM 33 ON MARCH 14 AND 15 AT DOUBLE TREE HOTEL, SAN JOSE, CA.
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SOURCE Thermal Engineering Associates