ALISO VIEJO, Calif., Dec. 17, 2015 /PRNewswire/ -- Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the company and its collaborators are the first recipients of the European Commission's Innovation Award Competition for their Smart Silicon-on-Insulator Sensing Systems Operating at High Temperature (SOI-HITS) FP7 research project. The organization's Innovation Award Competition is open to teams involved with FP7 projects from the area of "micro/nano electronics" or "smart system integration" that demonstrate significant importance for the European economy and the EU citizens.
SOI-HITS, which met the award criteria as a single innovation developed in an EU-funded project, was bestowed the Innovation Award by the EU Project Monitoring Officers. Led by Microsemi, SOI-HITS was a collaborative project involving several industry-leading institutions, including Cambridge CMOS Sensors, Cissoid, Honeywell, IREC, University of Cambridge, Université Catholique de Louvain and The University of Warwick.
"This prestigious award from the European Commission demonstrates Microsemi's success in innovative research, and showcases our expertise in building and factory automation thanks to the assistance of our talented collaborators," said Roger Holliday, senior vice president and general manager at Microsemi. "SOI-HITS is a game changer for emissions control, as this ambitious, innovative and timely project will enable significant energy consumption savings and reduce waste in processes."
The award-winning SOI-HITS research project focuses on the reduction of both energy consumption and waste gas emissions by moving the control sensing elements into the harsh areas not normally accessible to conventional electronics, increasing the number of sensors available for control. The project features multiple sensing devices packaged into one part, and a device able to operate at much higher temperatures than normal silicon devices (to 225 degrees Celsius). SOI-HITS also features alternative measurement methods, alternative packaging options and reduced running costs, and builds on Microsemi's expertise in package miniaturization. To learn more, visit http://www.microsemi.com/design-support/package-miniaturization-services.
"This is the first time we decided to provide such an award and we are delighted with the high quality applications we received. It was not easy to choose the winner, as the competition was really tough and many applications raised the enthusiasm of the selection committee," said Willy Van Puymbroeck, Head of Unit in Components at the European Commission's DG Connect.
The Microsemi-led team was recognized on Dec. 1 at the European Nanoelectronics Forum located at the Maritim Hotel in Berlin. A trophy was presented to Microsemi at the event by Van Puymbroeck, which the company accepted on behalf of the consortium. For more information about the SOI-HITS research project, visit http://www.soi-hits.eu/.
About Microsemi Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif, and has approximately 3,600 employees globally. Learn more at www.microsemi.com.
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SOURCE Microsemi Corporation