Teardown & Physical Analyses of Key Components of Apple's iPhone 6s Plus

Feb 18, 2016, 08:10 ET from Research and Markets

DUBLIN, Feb. 18, 2016 /PRNewswire/ --

Research and Markets (http://www.researchandmarkets.com/research/fkwzzz/apple_iphone_6s) has announced the addition of the "Apple iPhone 6s Plus - Teardown & Physical Analyses of Key Components" report to their offering.

The Apple iPhone 6s Plus holds many IC components which are listed and reviewed in the report. All these ICs (more than 60 references) have been opened in order to measure the real silicon area consumption. A special focus has been made to highlight the component structure and understand the manufacturing process on noteworthy components among 4 selected topics: Advanced packaging, MEMS/Sensor, RF and Imaging. True innovations have been observed in the sensors components like a new process for the MEMS microphone improving the SNR or a 3D packaging with TSV in the fingerprint sensor and many more.

Also a technological comparison with the Samsung Galaxy S6 has been made in order to understand choices made by both smartphone makers.

Key inspected components:

MEMS/Sensors components

Fingerprint sensor - new generation: new packaging, new processes (includes TSV) eCompass - new supplier, custom product which has never been used in a smartphone Microphone - new process improving the SNR 6-Axis IMU - new reference, custom design Ambient light sensor - new reference, wafer-level package

Imaging components

Front and rear camera modules Flash LED - flip-chip integration

Packaging components

Apple A9 Processor - advanced Package-on-Package (PoP) structure Qualcomm Snapdragon - multi-chip, smallest pitch on the board Dialog Power management - largest ball count WLP (380-ball)

RF component

Wi-Fi & Bluetooth combo module Power Amplifier Module

Key Topics Covered:

1. Executive Summary

2. Apple iPhone 6s Plus Teardown

3. Electronic Board - High Resolution Pictures - ICs Identification - ICs Identification (mfr., ref., fcn., pkg. type, size & pin count) - ICs Silicon Area - Repartition by package type - Mfr. Design wins ranking - ICs Package footprint & Silicon Area ranking - PCB Characteristics - PCB Cross-Section - PCB min. line width

4. Advanced Packaging

- Apple A9 PoP

- Package views & dimensions

- Package Opening & Dies measurement

- Package Cross-Section

- Qualcomm Snapdragon

- Package views & dimensions

- Package Opening & Dies measurement

- Package Cross-Section

- Dialog WLP Power Management

- Package views & dimensions

- Package Cross-Section

5. MEMS/Sensors - Fingerprint Sensor - Button Assembly View - Fingerprint sensor Cross-Section - Sensor dies measurement - 3-Axis eCompass - Package views & dimensions - Package Opening & Dies measurement - Package Cross-Section - Microphone - Package views & dimensions - Package Opening & Dies measurement - Package Cross-Section - 6-Axis IMU - Package views & dimensions - Package Opening & Die measurement - MEMS opening & sensor details - Cross-Section - Ambient Light Sensor - Package views & dimensions - Package Opening & Die measurement - Package Cross-Section

6. RF Devices

- 5G Wi-Fi & Bluetooth Combo Chip

- Package views & dimensions

- Package Opening & Dies Measurement

- Package Cross-Section

- Power Amplifier Module

- Package views & dimensions

- Package Opening & Dies measurement

- Package Cross-Section

7. Camera Modules & Flash LED - 12Mp Rear Camera Module - Module views & dimensions - Module Opening & CIS die measurement - Module Cross-Section - 5Mp Front Camera Module - Module views & dimensions - Module Opening & CIS die measurement - Module Cross-Section - Flash LED - Package views & dimensions - Package Opening & LED die measurement - Package Cross-Section

For more information visit http://www.researchandmarkets.com/research/fkwzzz/apple_iphone_6s

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SOURCE Research and Markets



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