TechConnect World and National Innovation Summit Announce Lead Corporate Partners for 2014 Co-located events will attract thousands of business, government, and academic representatives June 15-19 just outside Washington, D.C. at the Gaylord National Hotel & Convention Center

WASHINGTON, Dec. 11, 2013 /PRNewswire/ -- The lead Corporate Partners for the 2014 TechConnect World and National Innovation Summit include BASF, Boeing, Bosch, Lockheed Martin, MeadWestvaco (MWV), Merck, Momentive, and SK Innovation.  These top global corporations will join leaders and innovators focused on technology development and commercialization at the TechConnect World and National Innovation Summit June 15-19, 2014.  Both events will take place just outside the nation's capital at the Gaylord National Convention Center, National Harbor, MD.

Entering its 16th year, TechConnect World and the National Innovation Summit combine to create the world's largest global conference and marketplace for innovators, corporate technology developers, and investors. TechConnect will also once again host and be co-located with the National SBIR Conference, the largest SBIR event in the US.  At the National SBIR Conference, attendees meet one-on-one and hear from all SBIR federal funding agencies and components, including the Department of Defense, Department of Energy, and National Institutes of Health.

"We are thrilled at the corporate support for both the National Innovation Summit and TechConnect World," said Dr. Matthew Laudon, CEO of TechConnect.  "These corporations are global leaders in innovation and technology investment, and we are looking forward to their participation at the co-located events next June."

Corporate Partners will also participate in the TechConnect-National Innovation Summit Corporate Acceleration program, in which pre-vetted innovations are matched with corporate partners.  Corporate business and research development teams will be on-site for one-on-one meetings with participating innovators and will also speak in the program.

Submissions are now open for both technical abstracts and breakthrough innovations for the joint TechConnect World Conference and the National Innovation Summit and Showcase.

To submit your Technical Abstract for conference consideration (deadline: December 13), visit: www.techconnectworld.com/World2014/participate/authors/.

To submit your Innovation for conference and Showcase consideration (deadline January 31, 2014), visit: www.techconnectworld.com/World2014/participate/innovation/.

CONTACT: Jennifer Rocha, 1-774-249-8514, jrocha@techconnect.org

 

SOURCE TechConnect



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