AUSTIN, Texas, Jan. 11, 2016 /PRNewswire-USNewswire/ -- Tekmos, Inc., a leader specializing in supportable solutions in the development and manufacturing of mature microcontrollers, high temperature microprocessors up to 300 C, is pleased to announce the UNIFY Program. UNIFY is Tekmos' unique mixed signal ASIC approach to providing an engineering and device solution for companies developing an Internet of Things (IoT) product offering where the standalone processor and other standard components provide 90% of the solution, but not the 10% needed to finish the product.
Many companies have defined their product at the block diagram level and have the resources to design in processors and other devices. However, they lack the engineering resources at the chip level to provide an optimal integration of mixed signal and other interface functions quickly and for a reasonable entry price.
The UNIFY ASIC from Tekmos, includes higher level integration which may include mixed signal, power management functions, custom interface design, digital logic or special IP from FPGAs. This UNIFY solution can include stacked die with flash memory or other technologies to create a solution that uses much less board area and offers cost savings for programs. UNIFY is offered well below the NRE and revenue thresholds needed to satisfy larger ASIC companies.
The ability to combine mixed signal ASIC with other die in a stacked die solution is tailor made to the customer's application. UNIFY provides higher integration, lower cost and proprietary security advantages to make it more difficult for the competition to copy customer product designs.
The Tekmos UNIFY solution provides these benefits without the customer having to hire chip designers. Tekmos will implement the customer's requirements into the ASIC, which is then embedded with the other devices into a single package or module to greatly reduce board area and protect the customer's design from copycats.
Tekmos is a fabless semiconductor company specializing in sustainable solutions in the development and manufacturing of Unify ASICs for the Internet of Things, high temperature chips, "Drop in Replacements" of Microcontrollers, ASICs, Standard Parts, FPGAs. Tekmos uses stacked die assembly technology resulting in a single chip implementation of your system, bringing all of the advantages of an ASIC, but without the high NRE charges.
Bob Abrams, Bob.Abrams@Tekmos.com
Vice President of Sales and Business Development
7901 E. Riverside Dr. Building 2, Suite 150
Austin, Texas 78744
Phone: (512) 342-9871
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SOURCE Tekmos, Inc.