The Conventional & Advanced Packaging Market for IC Devices, Forecast to 2023 - FOWLP, MRQFN, Vertically Stacked Multichip Packages, and SiPs

DUBLIN, March 3, 2020 /PRNewswire/ -- The "The Worldwide Conventional and Advanced Packaging Market for IC Devices" report has been added to ResearchAndMarkets.com's offering.

Report Highlights

• Worldwide Integrated Circuit Market Forecasts, 2018-2023
• Worldwide IC Packaging Market Forecasts, 2018-2023
• Advanced Packaging Market Forecasts, 2018-2023

The Worldwide Conventional and Advanced Packaging Market for IC Devices examines the global marketplace of integrated circuits (ICs) and the many packaging designs developed for ICs. This comprehensive report presents a detailed analysis of a vast and vibrant IC market that is expected to reach $425 billion by 2023.

The 385-page report provides insightful analysis of major market trends affecting the IC industry and presents more than 170 tables quantifying both the IC devices and IC packaging markets. In addition, dozens of graphical figures provide an alternative perspective for understanding the underlying data.

The report provides extensive and detailed quantitative analysis with forecasts for unit shipments, revenues and package pricing for 30 separate IC device types as well as 14 major packaging categories comprising 44 IC packaging market segments. Also covered are advanced IC packaging market segments and interconnection solutions. Virtually every table presents year-end data for 2018, plus five-year forecasts from 2019 through 2023.

The report is arranged into six chapters:

An Introductory chapter (Chapter 1) and the Executive Summary (Chapter 2) present a short overview of the report with a description of its major conclusions and methodology. The remaining chapters focus on four major topics of discussion.

Chapter 3, Integrated Circuit Device Market Analysis, starts with a top-level view of the IC devices market with tables and figures detailing the market in terms of 30 distinct IC devices, plus additional segmentation by device functions (processors, logic, memory, and analog), and major world regions. The chapter then presents unit shipment and revenue forecasts of each device type in terms of the packaging types used for each.

Chapter 4, IC Packaging Market Analysis, examines the IC packaging market in deep granular detail. Tables provide historical data and forecasts of unit shipments, revenues and package ASP for 14 packagings "families" with additional segmentation based on the number of I/Os for the packaging types. Altogether, there are 44 market segments analyzed, each in terms of the IC devices embedded in the package.

Chapter 5: Advanced Packaging Markets, provides an in-depth discussion of the technologies and market trends of advanced packaging solutions:

• Fan-out wafer-level packaging (FOWLP)
• Multi-row QFN packaging (MRQFN)
• Vertically stacked multichip packages: TSOPs, QFNs, FBGAs, and WLPs
• System-in-packages (SiPs): package-on-packages, package in-packages, and multichip modules

Chapter 6: Interconnection Technologies and Solutions, provides a comprehensive examination of wire bonding and flip chip technology, in terms of both unit shipments and revenues. The analysis of flip chip markets includes forecasts of specific devices and packaging types. The chapter also examines the market potential of through-silicon vias (TSVs) for 2.5D and 3D packaging.

Key Topics Covered

Chapter 1: Introduction

Chapter 2: Executive Summary

Chapter 3: Integrated Circuit Device Market Analysis

• Worldwide Integrated Circuit Market
• Total Market Forecasts
• Regional Market Trends and Forecasts
• Market Forecasts by Device Type
• Processor Devices: MPUs, MCUs (4-bit, 8-bit, 16-bit, 32+-bit), DSPs
• Memory Devices: DRAM, SRAM, Flash, ROM/EPROM, EEPROM and Other
• Logic Devices: Digital Bipolar Devices, Standard Logic, Gate
• Arrays, Standard Cell and PLDs, Display Drivers and Touch
• Screen Controllers, Special-Purpose Logic (Consumer, Computers, Communications, Automotive, Multipurpose and Other)
• Analog Devices: Amplifiers and Comparators, Interfaces, Voltage Regulators and References, Data Converters, Application-Specific Analog (Consumer, Computers, Communications, Automotive, Industrial and Other)

Chapter 4 IC Packaging Market Analysis

• Worldwide IC Packaging Market
• Total IC Packaging Market Forecasts
• Package Pricing Trends
• IC Packaging Market by I/O Count
• IC Package Families Descriptions and Forecasts
• Dual In-Line Packaging (DIP) Market
• Transistor Outline Packaging (TO) Market
• Small Outline Transistor (SOT) Packaging Market
• Small Outline Packaging (SO) Market
• Thin Small Outline Packaging (TSOP) Market
• Chip Carrier (CC) Market
• Quad Flat Pack (QFP) Market
• Dual Flat Pack No-Lead Packaging (DFN) Market
• Quad Flat Pack No-Lead Packaging (QFN) Market
• Pin Grid Array Packaging (PGA) Market
• Ball Grid Array Packaging (BGA) Market
• Fine Pitch Ball Grid Array Packaging (FBGA) Market
• Wafer-Level Packaging (WLP) Market
• Direct Chip Attached (DCA) Market

Chapter 5 Advanced Packaging Markets

• Total Advanced IC Packaging Market Forecasts
• Fan-Out Wafer-Level Packaging
• Conventional WLPs versus Fan-Out WLPs
• Fan-Out WLP Market Trends and Forecasts
• Multi-Row QFN Packaging Trends and Forecasts
• Overview of Multichip Packaging Technology (MCP)
• Topic covers: Types of Multichip Packages, Benefits and Shortcomings, Multichip Packaging Challenges and Solutions, Techniques for Wafer Thinning MCP Total Forecasts
• Stacked Multichip Packaging Market Segments
• Stacked TSOP Market Trends and Forecasts
• Stacked QFN Market Trends and Forecasts
• FBGA Market Trends and Forecasts
• Stacked WLP Market Trends and Forecasts System-in-Package Market Segments
• Total SiP Market Trends and Forecasts
• Package-on-Package Market Forecasts
• Package-in-Package Market Forecasts
• Multichip Modules Market Forecasts
• Stacked WLPs within SiPs Market Forecasts

Chapter 6 Interconnection Technologies and Solutions

• Interconnection Technologies Overview
• Interconnection Market Forecasts
• Wire Bonding
• Wire Bonding Methods
• Wire Materials
• Wire Bonding Market Trends and Forecasts
• Flip Chip
• The Flip Chip Process
• Flip Chip Packaging Market Trends and Forecasts
• Flip Chip Package Device Market Trends and Forecasts
• Flip Chip Devices: MPUs, 32+-bit MCUs
• DSPs, Gate Arrays, Standard Cell and PLDs, Special-Purpose Logic (Consumer, Computer, Communications, Automotive, Multipurpose and Other), DRAM, SRAM, Flash, Application-Specific Analog (Computer, Communications)
• Bare Die Flip Chip Market Trends and Forecasts Through-Silicon Vias
• Forecasts of the Through-Silicon Via Market Segment

Appendix Glossary of IC Packaging Terms

For more information about this report visit https://www.researchandmarkets.com/r/a8pyi3

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