Toshiba NAND Solutions Address Growing Demand for Error Correction SLC NAND Offerings Support Requirements for Built-in ECC

IRVINE, Calif., Jan. 5, 2012  /PRNewswire/ -- Toshiba America Electronic Components, Inc. (TAEC)* today announced the development of BENAND[1], a versatile, multi-application single level cell (SLC) NAND flash memory with embedded error correction code (ECC). The simple interface and high reliability of small capacity SLC NAND has enabled it to be widely used in consumer applications and industrial programming. Samples of eight BENAND products in two capacities, 4Gb and 8Gb, are now available, with mass production beginning March 2012.

BENAND's diverse applications include LCD TVs, digital cameras, robots and other industrial applications that include 2-way radios, thermostats, home gateways, cable boxes, POS systems, smart meters, vending machines, in-flight entertainment systems and LCD advertising systems. BENAND removes the burden of ECC from the host processor while minimizing protocol changes and allowing host processors to support leading-edge process NAND flash memory in a timely manner. Package and pin configuration compatibility are assured with general SLC NAND flash, allowing for easy replacement in existing products.

Until now, the ECC has been embedded in the host processor and corrected 1 bit per 512 bytes. However, advances in memory process technology require enhanced error correction; more than 4 bit correction per 512 bytes for NAND flash fabricated with 32nm process. For NAND flash memory without ECC fabricated with 32nm and beyond, the controller in the host processor must be changed to secure the required level of correction.

"Toshiba's BENAND enables smooth migration to the latest SLC NAND process technologies," noted Brian Kumagai, senior business development manager, NAND flash memory products for TAEC.  "With its on-board ECC, BENAND provides rapid migration to higher density SLC NAND for long life-cycle applications such as industrial and OEM."

SLC-based BENAND joins Toshiba's family of embedded NAND solutions, the SmartNAND family, which integrates leading-edge 24nm process MLC NAND flash technology with a control chip that supports ECC and is available in densities ranging from 4 to 64 gigabytes (GB). BENAND is currently available in 4 gigabits (Gb) and 8Gb TSOP and BGA packages.

Looking to offer customers more choices and further its advances in memory products, Toshiba plans to expand the BENAND lineup to include 24nm process NAND flash memory products in Q2 2012.

[1] BENAND is a trademark of Toshiba Corporation.

 

Product Number

Capacity

I/O

Voltage

Package

Mass production

TC58BVG2S0FTA00

4Gbit

 

 

 

 

 

x8

 

 

 

2.7 to 3.6

48pin TSOP

March

 2012

 

 

TC58BYG2S0FTA00

1.7 to 1.95

48pin TSOP

TC58BVG2S0FBAI4

2.7 to 3.6

63ball FBGA

TC58BYG2S0FBAI4

1.7 to 1.95

63ball FBGA

TC58BVG2S5FBAI4

x16

 

2.7 to 3.6

63ball FBGA

TC58BYG2S5FBAI4

1.7 to 1.95

63ball FBGA

TH58BVG3S0FTA00

8Gbit

 

x8

 

2.7 to 3.6

48pin TSOP

2Q / 2012

 

TH58BYG3S0FTA00

1.7 to 1.95

48pin TSOP

 

Main Features

  1. 4 bit per 512 bytes ECC and 32nm process NAND flash memory are embedded in one package.
  2. Embedded versatile interface. Package and pin configuration compatibility are ensured with general SLC NAND flash, allowing easy replacement of existing products.
  3. Allows the host processor to apply cutting-edge process NAND flash memory regardless of the error correction ability of the host processor by embedding ECC in the NAND flash memory itself.

 

Specifications

Interface

General NAND flash memory interface

Page Size

4K Byte

Voltage

Vcc=2.7~3.6V,1.7~1.95V

Package

・48 pin TSOP(12mm x 20mm x 1.2mm)

・63 ball FBGA (9mm x 11mm x 1.0mm)

*About Toshiba Corp. and TAEC

Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), discrete devices, LCD displays, advanced materials, medical tubes, custom SoCs/ASICs, imaging products, microcontrollers and wireless components that make possible today's leading cell phones, MP3 players, cameras, medical devices, automotive electronics, enterprise solutions and more.

Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's third largest semiconductor manufacturer (Gartner, 2010 WW Semiconductor Revenue, April 2011). Toshiba was founded in 1875 and today has over 490 subsidiaries and affiliates, with 203,000 employees worldwide and annual sales of $77 billion. Visit Toshiba's web site at www.toshiba.co.jp/index.htm

For additional company and product information, please visit http://www.toshiba.com/taec/.

Product density is identified based on the density of memory chip(s) within the Product, not the amount of memory capacity available for data storage by the end user. Consumer-usable capacity will be less due to overhead data areas, formatting, bad blocks, and other constraints, and may also vary based on the host device and application.

Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice.  Technical and application information contained here is subject to the most recent applicable Toshiba product specifications.  In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba's "Handling Guide for Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook."  This information is available at www.chips.toshiba.com, or from your TAEC representative.

Editor's Note: Product photos can be downloaded at http://www.toshiba.com/taec/news/press_releases/2012/memy_12_625.jsp

media contact:
Dena Jacobson
Lages & Associates
Tel.: (949) 453-8080
dena@lages.com

 

 

SOURCE Toshiba America Electronic Components, Inc.



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