TSMC Announces Automotive Qualified 0.25-Micron One-Time-Programmable IP
HSINCHU, Taiwan, R.O.C., June 30 /PRNewswire-FirstCall/ -- Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today announced that its 0.25-micron One-Time-Programmable (OTP) IP now meets Automotive Electronics Council (AEC) standard AEC-Q100 specification.
The IP is fully compatible with TSMC Bipolar-CMOS- DMOS (BCD), mixed signal/analog and standard CMOS logic processes and does not require additional processing steps, making it an ideal System-on-Chip (SoC) choice for automotive power management and analog applications.
TSMC's 0.25-micron OTP IP passes AEC-Q100 grade 1 product qualification specifications, features fully tested at multi-probe electrical testability and supports the automotive industry's stringent 10-year data retention requirement in 125 degrees Celsius operating temperatures. It is designed to operate at single 5 volt supply voltage for read operations after programming at 7.5 volt.
Based on bit-cell structure licensed from eMemory Technology Inc., the OTP IP is supported by TSMC customization and failure analysis. Characterization and test methodologies documentation are available to meet the stringent automotive reliability requirement.
"This 0.25-micron automotive One-Time-Programmable IP introduction adds to TSMC's technology selection that also includes AEC-Q100 qualified 0.25-micron and 0.18-micron embedded flash IPs for MCU applications," Said Kuotung Cheng, director of automotive program at TSMC. "It addresses the growing demand for analog trimming, calibration configuration, encryptions keys, and in-field customizations."
For more information, please contact TSMC account management representatives.
TSMC is the world's largest dedicated semiconductor foundry, providing the industry's leading process technology and the foundry's largest portfolio of process-proven libraries, IPs, design tools and reference flows. The Company's managed capacity in 2009 totaled 9.96 million (8-inch equivalent) wafers, including capacity from two advanced 12-inch GIGAFABs™, four eight-inch fabs, one six-inch fab, as well as TSMC's wholly owned subsidiaries, WaferTech and TSMC China, and its joint venture fab, SSMC. TSMC is the first foundry to provide 40nm production capabilities. Its corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please visit http://www.tsmc.com.