Ultratech Achieves ISO 9001 and 14001 Certification for Singapore Operations and Recertification for U.S. Facility

Company meets latest ISO quality and environmental standards across all worldwide manufacturing sites

Sep 13, 2011, 16:30 ET from Ultratech, Inc.

SAN JOSE, Calif., Sept. 13, 2011 /PRNewswire/ -- Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography and laser-processing systems used to manufacture semiconductor devices and high-brightness LEDs (HB-LEDs), today announced that it has earned ISO 9001:2008 and 14001:2004 certification from the DQS-UL Group for its international operations headquarters in Singapore and recertification for its San Jose facility. Ultratech recently announced the opening of its Singapore operations, which includes engineering and manufacturing of its lithography systems and other related products, in addition to housing the company's international sales and service operations. Also, the recertification of the San Jose, Calif. facility enables Ultratech to provide its global customers with the same standards of high quality across both of its manufacturing sites.

Ultratech Senior Vice President of Operations Tammy Landon said, "Ultratech is committed to the highest standards of quality management and environmental sustainability, and we're pleased that DQS-UL has recognized our efforts with the granting of these certifications for our Singapore operations and recertification for our U.S. facility. Now, the same processes, procedures, work instructions, systems and methodologies that have been effective at our corporate headquarters in San Jose have also been implemented in our Singapore operations—creating a seamless transition of systems and processes between our two manufacturing sites. This transition provides our customers the confidence that any system manufactured in Singapore will have the same high standards of quality, performance and sustainability as a system built in San Jose."

ISO 9001:2008 is the latest edition of the ISO 9001 standard, which has become the global benchmark for assuring a quality management system is operational that satisfies quality requirements with the aim of enhancing customer satisfaction in supplier-customer relationships.  Likewise, ISO 14001:2004 is the latest edition of the ISO 14001 standard, one of a series of internationally recognized standards designed to build a company's environmental management system (EMS) and manage the performance of that system to continually improve the company's environmental performance.

"Ultratech had outstanding results for a first-site assessment of its Singapore facility," stated the lead auditor for DQS-UL. "Particularly noteworthy was the fact that extensive quality and environmental awareness training programs for both regular and contract employees had been well established and implemented. In addition, excellent housekeeping had been maintained throughout all areas of the site."

Information on Ultratech's quality and environmental program can be found on the company's website at http://www.ultratech.com/about/green.shtml.

Certain of the statements contained herein, which are not historical facts and which can generally be identified by words such as "anticipates," "expects," "thinks," "intends," "will," "could," "believes," "estimates," "continue," and similar expressions, are forward-looking statements under Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended, that involve risks and uncertainties, such as risks related to timing, delays, deferrals and cancellations of orders by customers, including as a result of semiconductor manufacturing capacity as well as our customers' financial condition and demand for semiconductors; demand for consumer devices; industry growth within the company's served markets; continued delivery of financial performance and value; cyclicality in the semiconductor and nanotechnology industries; general economic and financial market conditions including impact on capital spending, as well as difficulty in predicting changes in such conditions; rapid technological change and the importance of timely product introductions; customer concentration; our dependence on new product introductions and market acceptance of new products and enhanced versions of our existing products; lengthy sales cycles, including the timing of system installations and acceptances; lengthy and costly development cycles for laser-processing and lithography technologies and applications; integration, development and associated expenses of the laser processing operation; pricing pressures and product discounts; high degree of industry competition; intellectual property matters; changes in pricing by us, our competitors or suppliers; international sales and operations; timing of new product announcements and releases by us or our competitors; ability to volume produce systems and meet customer requirements; sole or limited sources of supply; effect of capital market fluctuations on our investment portfolio; ability and resulting costs to attract or retain sufficient personnel to achieve our targets for a particular period; dilutive effect of employee stock option grants on net income per share, which is largely dependent upon our achieving and maintaining profitability and the market price of our stock; mix of products sold; outcome of litigation; manufacturing variances and production levels; timing and degree of success of technologies licensed to outside parties; product concentration and lack of product revenue diversification; inventory obsolescence; asset impairment; changes to financial accounting standards; effects of certain anti-takeover provisions; future acquisitions; volatility of stock price; foreign government regulations and restrictions; business interruptions due to natural disasters or utility failures; environmental regulations; and any adverse effects of terrorist attacks in the United States or elsewhere, or government responses thereto, or military actions in Iraq, Afghanistan and elsewhere, on the economy, in general, or on our business in particular. Such risks and uncertainties are described in Ultratech's SEC reports including its Annual Report on Form 10-K filed for the year ended December 31, 2010 and our quarterly report on Form 10-Q for the quarter ended July 2 , 2011. Due to these and additional factors, the statements, historical results and percentage relationships set forth herein are not necessarily indicative of the results of operations for any future period. These forward-looking statements are based on management's current beliefs and expectations, some or all of which may prove to be inaccurate, and which may change. We undertake no obligation to revise or update any forward-looking statements to affect any event or circumstance that may arise after the date of this release.

About Ultratech: Ultratech, Inc. (Nasdaq: UTEK) designs, manufactures and markets photolithography and laser processing equipment.  Founded in 1979, the company's market-leading advanced lithography products deliver high throughput and production yields at a low, overall cost of ownership for bump packaging of integrated circuits and high-brightness LEDs (HB-LEDs). A pioneer of laser processing, Ultratech developed laser spike anneal technology, which increases device yield, improves transistor performance and enables the progression of Moore's Law for 45-nm and below production of state-of-the-art consumer electronics. Visit Ultratech online at: www.ultratech.com.

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SOURCE Ultratech, Inc.



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