Ultratech Introduces Superfast 3G CGS Inspection System For Use In Front-, Middle- And Back-end-of-line Production
The Superfast 3G Addresses a Wide Range of Applications Such as Overlay and Wafer Stress
SAN JOSE, Calif., Oct. 23, 2012 /PRNewswire/ -- Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography and laser-processing systems used to manufacture semiconductor devices and high-brightness LEDs (HB-LEDs), today introduced its new in-line wafer inspection system, the Superfast 3G, which provides the flexibility to address a wide range of applications including improved overlay control and enhanced yield. The system has the flexibility to be implemented anywhere in the production line―front-, middle- and back-end-of-line―to address issues confronting leading-edge device manufacturers.
At advanced technology nodes, variations in stress and distortion on a wafer can have a significant impact on device performance and yield. Traditional inspection tools put many different sensors and types of technologies into one tool to access different applications. Based on patented coherent gradient sensing technology (CGS), Ultratech's Superfast 3G utilizes a unique approach. The Superfast 3G provides the industry's highest wafer resolution and measures over 800,000 points of data per wafer compared to competing systems that measure less than 200 points per wafer. The system's high data density is what enables a wide range of applications from one measurement, as within-die, die-to-die and wafer-to-wafer process variations can be characterized quickly and comprehensively. In addition, the Superfast 3G has an edge-exclusion capability of less than 2mm, which is aligned with the industry requirements. The Superfast 3G is an example of Ultratech's commitment to provide leading technology that addresses the critical needs of its global customers in a cost-effective solution.
Ultratech Vice President of Technology and Chief Technologist for Surface Inspection Dave Owen explained, "Ultratech has had this technology for a while and has worked with customers to improve its capabilities. These customers concluded that this inspection capability was critical to improving overlay control, device performance and yield. The Superfast 3G takes an enormous amount of data in a short span of time and creates detailed wafer maps. Without the need for a dedicated target, this production system can measure both patterned and blanket wafers at any stage in the process flow. The CGS technology provides a high degree of flexibility that enables our customers to use a single type of wafer inspection tool across the entire fab line. Also, the Superfast 3G is a low cost-of-ownership and cost-per-point solution compared to competing systems. We are excited to introduce our flexible Superfast 3G in-line, wafer inspection solution to the industry."
Certain of the statements contained herein, which are not historical facts and which can generally be identified by words such as "anticipates," "expects," "thinks," "intends," "will," "could," "believes," "poised," "estimates," "continues," and similar expressions, are forward-looking statements under Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended, that involve risks and uncertainties, such as risks related to timing, delays, deferrals and cancellations of orders by customers, including as a result of semiconductor manufacturing capacity as well as our customers' financial condition and demand for semiconductors; demand for consumer devices; industry growth within the company's served markets; continued delivery of financial performance and value; cyclicality in the semiconductor and nanotechnology industries; our dependence on new product introductions and market acceptance of new products and enhanced versions of our existing products; lengthy sales cycles, including the timing of system installations and acceptances; lengthy and costly development cycles for laser-processing and lithography technologies and applications; integration, development and associated expenses of the laser processing operation; general economic and financial market conditions including impact on capital spending, as well as difficulty in predicting changes in such conditions; rapid technological change and the importance of timely product introductions; customer concentration; pricing pressures and product discounts; high degree of industry competition; intellectual property matters; changes in pricing by us, our competitors or suppliers; international sales and operations; timing of new product announcements and releases by us or our competitors; ability to volume produce systems and meet customer requirements; sole or limited sources of supply; effect of capital market fluctuations on our investment portfolio; ability and resulting costs to attract or retain key personnel; dilutive effect of employee stock option grants on net income per share, which is largely dependent upon our achieving and maintaining profitability and the market price of our stock; mix of products sold; outcome of litigation; manufacturing variances and production levels; timing and degree of success of technologies licensed to outside parties; product concentration and lack of product revenue diversification; inventory obsolescence; asset impairment; changes to financial accounting standards; effects of certain anti-takeover provisions; future acquisitions; volatility of stock price; foreign government regulations and restrictions; business interruptions due to natural disasters or utility failures; environmental regulations; and any adverse effects of terrorist attacks in the United States or elsewhere, or government responses thereto, or military actions in Iraq, Afghanistan and elsewhere, on the economy, in general, or on our business in particular. Such risks and uncertainties are described in Ultratech's SEC reports including its Annual Report on Form 10-K filed for the year ended December 31, 2011 and our quarterly report on Form 10-Q for the quarter ended June 30, 2012. Due to these and additional factors, the statements, historical results and percentage relationships set forth herein are not necessarily indicative of the results of operations for any future period. These forward-looking statements are based on management's current beliefs and expectations, some or all of which may prove to be inaccurate, and which may change. We undertake no obligation to revise or update any forward-looking statements to reflect any event or circumstance that may arise after the date of this release.
About Ultratech: Ultratech, Inc. (Nasdaq: UTEK) designs, manufactures and markets photolithography and laser processing equipment. Founded in 1979, the company's market-leading advanced lithography products deliver high throughput and production yields at a low, overall cost of ownership for bump packaging of integrated circuits and high-brightness LEDs (HB-LEDs). A pioneer of laser processing, Ultratech developed laser spike anneal technology, which increases device yield, improves transistor performance and enables the progression of Moore's Law for 32-nm and below production of state-of-the-art consumer electronics. Visit Ultratech online at: www.ultratech.com.
SOURCE Ultratech, Inc.
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