Ultratech Secures Repeat AP Order Win With OSAT Customer
Major OSAT Orders Ultratech AP300W for High-volume Advanced Packaging Applications
SAN JOSE, Calif., July 2, 2013 /PRNewswire/ -- Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography and laser-processing systems used to manufacture semiconductor devices and high-brightness LEDs (HB-LEDs) announced that it has received a repeat order from a leading outsourced semiconductor assembly and test (OSAT) company in Asia. The AP300W lithography system built on Ultratech's customizable Unity Platform™ will be utilized for wafer-level packaging (WLP) applications to support growth driven by communication devices. As the advanced packaging technology requirements evolve, OSATs will play an important role in establishing the supply chain. This major win further confirms Ultratech's ability to deliver operational flexibility, technology leadership and highest economic value for its customers.
"Demand for thinner mobile communication devices such as smartphones and tablets are driving much of the growth in WLP," according to Jan Vardaman, president and founder of TechSearch International. "Many of the suppliers of the integrated circuits used in these products depend on OSATs to meet their production needs. It is expected that the OSAT expansion will continue over the next several years to address this growth opportunity."
Ultratech Vice President, Advanced Packaging Technology/Nanotechnology Market Manish Ranjan said, "Ultratech has maintained a leading market position over the last decade by delivering outstanding production performance with superior cost-of-ownership solutions. We look forward to working closely with our customers in the OSAT segment to support their high-volume production ramps."
Certain of the statements contained herein, which are not historical facts and which can generally be identified by words such as "anticipates," "expects," "thinks," "intends," "will," "could," "can," "may," "believes," "poised," "estimates," "continues," "looks forward to," and similar expressions, are forward-looking statements under Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended, that involve risks and uncertainties, such as risks related to timing, delays, deferrals and cancellations of orders by customers, including as a result of semiconductor manufacturing capacity as well as our customers' financial condition and demand for semiconductors; demand for consumer devices; industry growth within the company's served markets; continued delivery of financial performance and value; cyclicality in the semiconductor and nanotechnology industries; our dependence on new product introductions and market acceptance of new products and enhanced versions of our existing products; lengthy sales cycles, including the timing of system installations and acceptances; quarterly revenue fluctuations; lengthy and costly development cycles for laser-processing and lithography technologies and applications; integration, development and associated expenses of the laser processing operation; general economic and financial market conditions including impact on capital spending, as well as difficulty in predicting changes in such conditions; rapid technological change and the importance of timely product introductions; customer concentration; pricing pressures and product discounts; high degree of industry competition; intellectual property matters; changes in pricing by us, our competitors or suppliers; international sales and operations; timing of new product announcements and releases by us or our competitors; ability to volume produce systems and meet customer requirements; sole or limited sources of supply; effect of capital market fluctuations on our investment portfolio; ability and resulting costs to attract or retain key personnel; dilutive effect of employee stock option grants on net income per share, which is largely dependent upon our achieving and maintaining profitability and the market price of our stock; mix of products sold; outcome of litigation; manufacturing variances and production levels; timing and degree of success of technologies licensed to outside parties; product concentration and lack of product revenue diversification; inventory obsolescence; asset impairment; changes to financial accounting standards; effects of certain anti-takeover provisions; future acquisitions; volatility of stock price; foreign government regulations and restrictions; business interruptions due to natural disasters or utility failures; environmental regulations; and any adverse effects of terrorist attacks in the United States or elsewhere, or government responses thereto, or military actions in the Middle East, Afghanistan and elsewhere, or geopolitical instability on the Korean Peninsula and other parts of Asia, on the economy, in general, or on our business in particular. Such risks and uncertainties are described in Ultratech's SEC reports including its Annual Report on Form 10-K filed for the year ended December 31, 2012. Due to these and additional factors, the statements, historical results and percentage relationships set forth herein are not necessarily indicative of the results of operations for any future period. These forward-looking statements are based on management's current beliefs and expectations, some or all of which may prove to be inaccurate, and which may change. We undertake no obligation to revise or update any forward-looking statements to reflect any event or circumstance that may arise after the date of this release.
About Ultratech: Ultratech, Inc. (Nasdaq: UTEK) designs, builds and markets manufacturing systems for the global technology industry. Founded in 1979, Ultratech serves three core markets: front-end semiconductor, back-end semiconductor, and nanotechnology. The company is the leading supplier of lithography products for bump packaging of integrated circuits and high-brightness LEDs. Ultratech is also the market leader and pioneer of laser spike anneal technology for the production of advanced semiconductor devices. In addition, the company offers solutions leveraging its proprietary coherent gradient sensing (CGS) technology to the semiconductor wafer inspection market and provides atomic layer deposition (ALD) tools to leading research organizations, including academic and industrial institutions. Visit Ultratech online at: www.ultratech.com.
Unity Platform is a trademark of Ultratech, Inc.
SOURCE Ultratech, Inc.
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