Xilinx Wins 2013 3D InCites Award for World's First Heterogeneous All Programmable 3D IC Virtex-7 H580T FPGA recognized for its revolutionary contribution to the 3D IC industry
SAN JOSE, Calif., July 23, 2013 /PRNewswire/ -- Xilinx, Inc. (NASDAQ: XLNX) today announced that its Virtex®-7 H580T FPGA, the world's first heterogeneous All Programmable 3D IC, won the "3D Products (Design/Process)" category in this year's 3D InCites Awards, which recognize the companies that are revolutionizing the 3D IC industry and which were presented last week by 3D InCites and TechSearch International during the SEMICON West conference.
"This award is a tremendous recognition of just how advanced our industry-leading Virtex-7 HT FPGA is, of its acceptance in the market place, and how it is advancing the state-of-the-art in 3D IC technology," said Dave Myron, sr. director, FPGA Product Management & Marketing at Xilinx. "This award further validates our dedication to innovation and continuously advancing the semiconductor industry. Our employees and design team are committed to meeting the needs of our customers and this devotion to technology excellence is what keeps Xilinx the market leader."
The Virtex-7 H580T FPGA was recognized for its contributions to advancing the state-of-the-art 3D IC technology during the past year. Like other Xilinx All Programmable 3D IC devices, the Virtex-7 H580T FPGA addresses the challenges of interconnecting multiple FPGAs utilizing Xilinx's Stacked Silicon Interconnect (SSI) technology, enabling high-bandwidth connectivity between multiple die and providing a 100x improvement in inter-die bandwidth per watt compared to multi-chip approaches.
"We decided it was time to show some recognition for all the hard work that's been going on for the past 10 years to bring 2.5D and 3D IC technologies to commercialization," said Francoise von Trapp, founder of 3D InCites. "Thanks to the success of Xilinx's Virtex-7 devices which are available today and the efforts of the other awarded companies in solving remaining technology and economic hurdles, we are getting closer to achieving this goal."
The 3D InCites Awards program was established in 2013 by 3D InCites, the premiere online content source for reliable 3D technology information, and TechSearch International, the leading market research and intelligence firm for advanced semiconductor packaging technology, to recognize achievements to further the commercialization of 2.5D and 3D IC technologies. This year's award raised $5000 for the Frances B. Hugle Engineering Scholarship, which encourages young women to pursue engineering careers.
About 3D InCites
3D InCites is an online content source founded in 2009 in an effort to stir up interest in 3D IC integration and 3D packaging technologies. For 3D integration to happen, open collaboration across the supply chain is required. Therefore, 3D InCites strives to inform key decision makers about progress in technology development, design, standards, and infrastructure in order to realize commercial production of 2.5D and 3D technologies. 3D InCites is powered by Impress Labs (www.impresslabs.com), a global creative and marketing communications agency specializing in building brands for technology companies in the semiconductor, solar energy and life science industries. For more information, visit www.3DInCites.com.
Xilinx is the world's leading provider of All Programmable FPGAs, SoCs and 3D ICs. These industry-leading devices are coupled with a next-generation design environment and IP to serve a broad range of customer needs, from programmable logic to programmable systems integration. For more information, visit www.xilinx.com.
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Silvia E. Gianelli
SOURCE Xilinx, Inc.