News from ev group A wide array of domestic and global news stories; news topics include politics / government, business, technology, religion, sports/entertainment, science/nature, and health/lifestyle. Articles that appear in this section may be written in English or other languages, as well.

Jun 30, 2014, 09:00 ET
EVG(r)GEMINI FB XT Automated Production Fusion Bonding System for 3D-IC/TSV Manufacturing (PRNewsFoto/EV Group)

EV Group Clears Key Barriers To 3D-IC/TSV High-Volume Manufacturing With Breakthrough Fusion Wafer Bonding Solution

 EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...

Mar 17, 2014, 21:00 ET

EV Group Establishes China Headquarters In Shanghai

SEMICON CHINA -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor...

Mar 12, 2014, 13:00 ET
EVG(R)150N XT Automated NanoSpray(TM) Coating System.  (PRNewsFoto/EV Group)

EV Group Boosts 2.5D And 3D-IC/TSV Performance With New NanoSpray Application On EVG150XT High-Volume-Manufacturing Photoresist Processing System

 EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...

Feb 25, 2014, 09:00 ET

EV Group And Brisbane Materials Introduce Novel Anti-Reflective Coating Solution For LED Lighting Applications At Strategies In Light 2014

 STRATEGIES IN LIGHT— EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology, solar...

Feb 11, 2014, 09:00 ET
The EVG(R)150XT is the industry's first high-volume-manufacturing resist processing system for 300-mm logic and memory mid-end and back-end interconnect applications.  (PRNewsFoto/EV Group)

EV Group Unveils High-Volume-Manufacturing Photoresist Processing System For Logic And Memory Advanced Packaging Applications

 EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...

Jan 14, 2014, 09:00 ET
Insulated Gate Bipolar Transistor (IGBT) wafer processed on EVG(r)850TB/DB fully automated bonding/debonding system. (PRNewsFoto/EV Group)

EV Group Ships Temporary Bonding/Debonding System To Fraunhofer ISIT For Developing Advanced Power Devices

 EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...

Dec 10, 2013, 09:00 ET
The EVG(r)850LT fully automated production bonding system combines all essential steps for wafer bonding in a single platform to ensure an ultra-clean production process throughout all stages, thereby enabling high-yield, void-free wafers.  It supports a variety of advanced substrates, including silicon-on-insulator (SOI) and silicon on lattice engineered substrate (SOLES) technology, up to 300 mm in diameter.  (PRNewsFoto/EV Group)

Singapore-MIT Alliance For Research Technology Orders EV Group Automated Production Bonding System For Silicon-On-Insulator And Direct Wafer Bonding

 EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...

Dec 03, 2013, 09:00 ET
The EVG(r)720 automated UV-NIL system provides full-field imprint lithography with an integrated soft stamp/template fabrication capability.  Enabling throughputs of more than 60 wph with the lowest CoO, it can print nanostructures as small as 40 nm over a large area in volume production.  It is ideally suited for manufacturing optics, photonics, LEDs, microfluidics and other bioMEMS devices, as well as advanced data storage devices.  (PRNewsFoto/EV Group)

EV Group Introduces Full-field UV Nanoimprint Lithography System For Photonics, LED And BioMEMS Production

 EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...

Nov 19, 2013, 09:00 ET
The EVG(r)PHABLE(tm) from EV Group is a non-contact mask-based lithography solution that enables full-field, high-resolution and cost-efficient micro- and nanopatterning of passive and active photonic components, such as patterned structures on light emitting diode (LED) wafers, in high-throughput production environments.  (PRNewsFoto/EV Group)

EV Group Introduces Non-Contact Lithography System For Cost-Efficient Volume Production Of Passive And Active Photonic Components

 EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...

Oct 28, 2013, 09:00 ET

EV Group Ships Lithography System to Micronit for Lab-on-a-chip and Optical MEMS Device Production

MICROTAS -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets,...

Oct 08, 2013, 09:00 ET
EV Group unveils the industry's first roll-to-roll thermal nanoimprint lithography tool, the EVG(R)570R2R, which mass-produces films and surfaces with micro- and nanometer-scale structures for a variety of medical, consumer and industrial applications, including micro-fluidics, plastic electronics and photovoltaics. (PRNewsFoto/EV Group)

EV Group Introduces Roll-To-Roll Nanoimprint Lithography System For Biomedical, Optical And Flexible Electronics Applications

PLASTIC ELECTRONICS --EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor...

Sep 04, 2013, 09:00 ET
EV Group unveils a new via-filling process to improve the reliability of 3D-IC/TSV semiconductor packaging applications.  Shown here is an EVG(r)150 automated resist processing system.  Image courtesy of EV Group.  (PRNewsFoto/EV Group)

EV Group Unveils New Via-Filling Process to Improve Reliability of 3D-IC / TSV Packaging

 SEMICON TAIWAN -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and...

Sep 03, 2013, 09:00 ET
Dow Corning joins EV Group's open platform for temporary wafer bonding materials for 3D-IC manufacturing.  Shown here is an EVG(r)850 XT Frame automated production temporary bonding and debonding system.  (PRNewsFoto/EV Group)

Dow Corning Joins EV Group's Open Platform For Temporary Bonding Materials For 3D-IC Manufacturing

 EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets,...

Jul 09, 2013, 09:00 ET

EV Group Showcases Latest Photovoltaic Manufacturing Advances At Intersolar North America 2013

 INTERSOLAR NORTH AMERICA -- EV Group (EVG), a leading equipment supplier for photovoltaic (PV) cell and module manufacturing, including...

Jul 09, 2013, 09:00 ET

EV Group Celebrates Strong Growth And New Manufacturing Process Solutions At SEMICON West 2013

 EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...

Jul 08, 2013, 09:00 ET
EVG(r)40NT automated measurement system for 3D-IC manufacturing.  (PRNewsFoto/EV Group)

EV Group Pushes The Limits On 3D-IC Manufacturing For Next-Generation CMOS Image Sensors

 EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...

Jul 01, 2013, 09:00 ET
EV Group's LowTemp(tm) room-temperature debonding platform is available on the company's temporary bonding/debonding systems, including the EVG850TB/DB XT Frame platform.  (PRNewsFoto/EV Group)

EV Group Enhances Wafer Debonding Solutions Portfolio With New LowTemp™ Room-Temperature Debonding Platform

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...

Jun 17, 2013, 09:00 ET
EVG320RS XT platform.  (PRNewsFoto/EV Group)

EV Group And Dynaloy Jointly Develop Complete Single-Wafer Cleaning Solution For 3D-IC/TSV, Advanced Packaging, MEMS And Compound Semiconductor Applications

 EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, and Dynaloy, LLC, an international manufacturer of chemicals...

May 07, 2013, 09:00 ET
EVG120(R) Automated Resist Processing System.  (PRNewsFoto/EV Group (EVG))

EV Group Rolls Out Next-Generation EVG120 Automated Resist Processing System For Micro- And Nano-Electronics Production

SEMICON SINGAPORE -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and...

Mar 13, 2013, 09:00 ET
EVG GEMINI(R) Wafer Bonding System.  (PRNewsFoto/EV Group (EVG))

EV Group Ships 300-mm Wafer Bonding System To Leading Chinese Semiconductor Foundry For 3D IC And Advanced Packaging Volume Production Applications

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...

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