Equipment & Materials for 3DIC & Wafer-Level Packaging Applications

News provided by

Jan 02, 2015, 06:47 ET

DUBLIN, Jan. 02, 2015 /PRNewswire/ --Research and Markets

(http://www.researchandmarkets.com/research/t4dphj/equipment_and) has announced the addition of the "Equipment & Materials for 3DIC & Wafer-Level Packaging Applications " report to their offering.

(Logo: http://photos.prnewswire.com/prnh/20130307/600769)

Mainly supported today by flip-chip wafer bumping, the equipment market generated revenue of more than $930M in 2013. It is expected that this equipment market revenue will peak at almost $2.5B. It is fueled by the 3D IC technology with TSV interconnects, an area offering opportunities for new developments in equipment modificationequipment that is much more expensive than the tools used for established Advanced Packaging platforms (3D WLP, WLCSP, flip-chip wafer bumping). Indeed, 2015 will be the key turning point for the adoption of 3D TSV Stacks since the memory manufacturers, such as Samsung, SK Hynix, Micron, have already started to ship prototypes this year and might be ready to enter in high-volume manufacturing next year.

Key Topics Covered:

1. Report scope & definitions

2. Glossary

3. Companies cited in this report

4. Definitions, limitations & methodology

5. Analysis comparison: 2011 vs. 2014

6. Who should be interested in this report?

7. Executive summary

8. Equipment market forecast for 3D & WLP

9. 3DIC & WLP technologies process flows & manufacturing trends analysis

10. Conclusions & perspectives

Companies Mentioned: