Maxim Integrated MAX21000 - 3-Axis MEMS Gyroscope Technology Analysis

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Dec 18, 2014, 08:49 ET

DUBLIN, Dec. 18, 2014 /PRNewswire/ --Research and Markets

(http://www.researchandmarkets.com/research/x8pgd6/maxim_integrated) has announced the addition of the "Maxim Integrated MAX21000 - 3-Axis MEMS Gyroscope Technology Analysis" report to their offering.

http://photos.prnewswire.com/prnh/20130307/600769

Following the purchase of MEMS manufacturer SensorDynamics in 2011, Maxim releases its first MEMS Gyroscope reference with a very accurate and cost effective component.

The MAX21000 continues to use the PSM-X2 process jointly developed by SensorDynamics and the Fraunhofer Institute for Silicon Technology. This technology platform includes a proprietary surface micromachining process to build the mechanical structures and a gold silicon eutectic wafer bonding allowing an hermetic encapsulation of the gyro sensor.

Compared with state of the art 3x3mm MEMS gyroscopes supplied by STMicroelectronics and Bosch Sensortec, the new design developed by Maxim for this reference offers 28% to 35% reduction in silicon area for the MEMS die, enabling a significant cost advantage.

Assembled in a LGA 3.0x3.0x0.9mm package, the MAX21000 is a low power consumption (5.4mA) and high accuracy 3-axis gyroscope targeted for mobile application.

The Technology Analysis report contains only Physical Analysis & Manufacturing Process Flow. A full reverse costing analysis is also available, for more information please click on the link below.

Key Topics Covered:

Glossary

Overview/Introduction , Maxim Company Profile

Physical Analysis

Package

Package Views & Dimensions
Package Pin Out
Package Opening
Wire Bonding Process
Package Cross-Section

ASIC Die

View, Dimensions & Marking
Delayering
Main Blocks Identification
Cross-Section
Process Characteristics

MEMS Die

View, Dimensions & Marking
Bond Pad Opening
Cap Removed & Cap Details
Sensing Area Details
Cross-Section (Sensor, Cap & Sealing)
Process Characteristics

Manufacturing Process Flow

Global Overview
ASIC Front-End Process
ASIC Wafer Fabrication Unit
MEMS Process Flow
MEMS Wafer Fabrication Unit
Packaging Process Flow
Package Assembly Unit

For more information visit http://www.researchandmarkets.com/research/x8pgd6/maxim_integrated

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