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Supermicro® estrena placa base y soluciones de sistema integradas
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Super Micro Computer, Inc.

Sep 02, 2015, 03:29 ET

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- Supermicro® estrena placa base y soluciones de sistema integradas que dan soporte a la nueva familia de procesadores Intel® Core™ de 6ª generación

Las soluciones incluyen disponibilidad de producto durante 7 años optimizada para aplicaciones comerciales, industriales, médicas y militares e Internet of Things (IoT)

SAN JOSE, California, 2 de septiembre de 2015 /PRNewswire/ -- Super Micro Computer, Inc. (NASDAQ: SMCI), un líder global en servidores de alto rendimiento y alta eficiencia, tecnología de almacenamiento y computación verde, anuncia la disponibilidad inmediata de la placa base integrada y soluciones de sistema de soporte para la nueva familia de procesador Intel® Core™ de 6ª generación  (conocido como Skylake). Las nuevas placas base compactas y soluciones de sistema dirigidas a aplicaciones integradas en los sectores comercial, industrial, médico y militar ofrecen mayor rendimiento computacional y gráfico con mayor eficiencia energética. Estas nuevas soluciones ofrecen características avanzadas como Intel® Software Guard Extensions (Intel® SGX) e Intel® Memory Protection Extensions (Intel® MPX) que impulsan la seguridad cuando se combinan con la puerta de enlace IoT de Supermicro (SYS-E100-8Q) ofreciendo la infraestructura de extremo a nube más robusta. 

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"Los productos integrados de próxima generación de Supermicro ofrecen el mejor rendimiento, eficiencia y características en su clase con el soporte para los nuevos procesadores Intel Core de 6ª generación", dijo Charles Liang, director general y consejero delegado de Supermicro. "Nuestra cartera de soluciones ampliada cubre el rango más amplio de aplicaciones de los sectores comercial, industrial, médico y militar. Cuando se combina con nuestra puerta de enlace IoT, Supermicro ofrece soluciones de infraestructura de extremo a extremo para las operaciones y aplicaciones de datos de misión crítica".

"La nueva familia de procesadores Intel® Core™ de sexta generación ofrece una CPU y rendimiento de gráficos rápidos, un amplio rango de energía y escalabilidad de características y nuevas características avanzadas que impulsan los diseños IoT desde el extremo a la nube. La opción de Supermicro de incorporar los procesadores Intel® Core™ de 6ª generación en la última línea de productos se beneficia de las últimas tecnologías de Intel que le permiten ofrecer una solución unificada para sus clientes, abarcando un amplio rango de rendimiento, precio y capacidad", dijo Samuel Cravatta, director de la Línea de producto de IOTG.

Foto - http://photos.prnewswire.com/prnh/20150901/262636

Especificaciones de producto:

  • UP Motherboard uATX 9.6" x 9.6" form factor (X11SSQ) – Admite procesadores Intel® Core™ de 6ª generación (hasta 65W TDP), procesadores Intel® Celeron®, y procesadores Intel® Pentium® Socket H4 (LGA 1151), Intel® Q170 chipset, 6x SATA3 (6Gb/s) puertos, RAID 0,1,5,10 Intel RST, 64GB Non-ECC DDR4-2133MHz in 4x UDIMMs, 1x PCI-E 3.0 (x16), 2x PCI-E 3.0 (x4), 1x PCI-E 3.0 (x1), M.2 M key 2242/2280 PCI-E x2, dual GbE, 1x HDMI, 1x DP (DisplayPort), 1x DVI-D, 1x eDP (Embedded DisplayPort), 1x SuperDOM, 8x USB 2.0 ports (4x rear + 4x via headers), 4x USB 3.0 puertos (2x rear + 2x via header), tecnología Intel® vPro™ con Intel® Active Management technology (Intel® AMT), conector de energía ATX, disponibilidad de 7 años. Para uso en aplicaciones de aparatos médicos u otros integrados. Chasis optimizado CSE-842i-500B
  • UP Motherboard uATX 9.6" x 9.6" form factor (X11SSZ-QF) – Admite procesadores Intel® Core™ (hasta 65W TDP) de 6ª generación, procesadores Intel® Celeron® y procesadores Intel® Pentium® Socket H4 (LGA 1151), Intel® Q170 chipset, 4x SATA3 (6 Gb/s) puertos, RAID 0,1,5,10, 64GB Non-ECC DDR4-2133MHz in 4x UDIMMs, 1x PCI-E 3.0 x16, 2x PCI-E 3.0 (x4 en x8), dual GbE, 2x DP (DisplayPort), 1x DVI-I, 1x VGA, 1x SuperDOM, 9x USB 2.0 puertos (2x traseros + 6x mediante headers + 1x Type A), 4x USB 3.0 puertos (2x traseros + 2x mediante header), IPMI 2.0, tecnología Intel® vPro™ con Intel® Active Management Technology (Intel® AMT), conector de energía 8-pin 12V DC, conector de energía ATX, disponibilidad de 7 años. Para uso en aplicaciones de aparatos médicos u otros integrados. Chasis optimizado 1U 512-203B, 512F-350B, 514-441, 514-R400C, 515-505, 813MTQ-280CB, 813MTQ-350CB, CSE-842i-500B
  • UP Motherboard Mini-ITX 6.7" x 6.7" form factor (X11SSV-Q) – Admite procesadores Intel® Core™de 6ª generación (hasta 65W TDP) , procesadores Intel® Celeron®, procesadores Intel® Pentium® Socket H4 (LGA 1151), Intel® Q170 chipset, 5x SATA3 (6 Gb/s) puertos RAID 0,1,5,10 Intel® RST, 32GB Non-ECC DDR4-2133MHz en 2x SO-DIMM s, 1x PCI-E 3.0 (x16), Mini-PCI-E con soporte mSATA, M.2 PCI -E 3.0 (x4) con soporte SATA, 2242/2280 M Key, dual GbE, 1x HDMI, 1x DP (DisplayPort), 1x DVI-I, 2x SuperDOM, 5x USB 2.0 puertos (4x mediante headers + 1x Type A), 6x USB 3.0 puertos (4x traseros + 2x mediante header), tecnología Intel® vPro™ con Intel® Active Management Technology (Intel® AMT), conector de 4-pin 12V DC, conector ATX, disponibilidad de 7 años. Para uso en aplicaciones de aparatos médicos o integrados.
  • Embedded 1U SuperServer® (SYS-5019S-M2) – Admite procesadores Intel® Core™ de 6ª gen, procesadores Intel® Celeron®,  procesadores Intel® Pentium® Socket H4 (LGA 1151), Intel® Q170 chipset, 64 GB de Non-ECC DDR4-2133MHz en 4x UDIMMs, 4x 3.5" SATA3 hot-swap drive bays, 1x PCI-E x16 Gen 3 FH, FL slot, admite 3x pantallas independientes (2x DP, DVI-I), TPM header, IPMI 2.0, tecnología Intel® vPro™ con Intel® Active Management Technology (Intel® AMT), Audio header, siministro eléctrico de alta eficiencia de 350W, disponibilidad de 7 años. Optimizado para Security and Surveillance Appliance Server.
  • Embedded 1U Short-Depth Server (SYS-1019S-M2) – Admite procesadores Intel® Core™ de 6ª generación, procesadores Intel® Celeron®, procesadores Intel® Pentium® Socket H4 (LGA 1151), Intel® Q170 chipset, 64GB de Non-ECC DDR4-2133MHz en 4x UDIMMs, 2x SATA3, 4x USB 3.0, 1x USB 2.0 (tipo A), Dual GbE LAN, admite 3x pantallas independientes (2x DP, DVI-I), 1x PCI-E3.0 (x16) para Full Height y Full Length en tarjeta, TPM header, 1x SuperDOM, IPMI 2.0, tecnología Intel® vPro™ con Intel® Active Management Technology (Intel® AMT), Redundant 200W Platinum Level, High Efficiency (95%+) suministros eléctricos (módulo opcional Batter Backup Power (BBP™)), disponibilidad de 7 años. Optimizado para Machine Automation Server, Compact Military 1U Server, VOIP y Network Appliance, y Medical Application Servers.
  • Embedded Mini Tower Server (SYS-5029S-TN2) – Admite procesadores Intel® Core™ de 6ª generación, procesadores Intel® Celeron®, procesadores Intel® Pentium® Socket H4 (LGA 1151), Intel® Q170 chipset, 32GB de DDR4-2133MHz en 2x SO-DIMMs, 5x SATA3, 6x USB 3.0, 5x USB 2.0, dual GbE LAN, admite 3x pantallas independientes (HDMI/DP/DVI-I), 2x COM puertos, Audio, 1x PCI-E 3.0 (x16), 1x M.2 (M key 2242/80 PCI-E 3.0 (x4)), 1x Mini-PCI-E con soporte mSATA, TPM header, tecnología Intel® vPro™ con Intel® Active Management Technology (Intel® AMT), disponibilidad de 7 años. Optimizado para Retail Technology Automation Small Medium Business, ATM, Kiosk, Surveillance appliance, Storage Appliance.
  • IoT Gateway (SYS-E100-8Q) – Compact, Ultra Low-Power, Fanless Edge to Cloud Mesh Network Device. Admite Intel® Quark™ X1021 SoC (2.2W), 512MB DDR3 ECC memoria, 1x Micro SDHC hasta 32GB, 2x Mini-PCI-E slots, 1x ZigBee módulo de socket, TPM 1.2, 2x 10/100Mbps RJ45, temperatura de operación de 0 °C a 50 °C

Para más información sobre la gama completa de soluciones de servidor, almacenamiento y red de alta eficacia y altas prestaciones de Supermicro, visite www.supermicro.com/Embedded.

Siga a Supermicro en Facebook y Twitter para recibir las últimas noticias y anuncios.

Acerca de Super Micro Computer, Inc.
Supermicro® (NASDAQ: SMCI), líder en innovación en tecnología de servidores de alta eficacia y alto rendimiento, provee a clientes de todo el mundo con Building Block Solutions® para centros de datos, computación en nube, TI empresarial, Hadoop/Big Data, HPC y sistemas integrados a nivel mundial. Supermicro se compromete a proteger el medio ambiente por medio de su iniciativa "We Keep IT Green®", proporcionando a los clientes las soluciones energéticas más eficientes y comprometidas disponibles de cara al medio ambiente dentro del mercado.

Supermicro, Building Block Solutions y We Keep IT Green son marcas comerciales y/o registradas de Super Micro Computer, Inc.

El resto de marcas, nombres y marcas comerciales son propiedad de sus respectivos dueños.

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