DUBLIN, Dec. 09, 2014 /PRNewswire/ --Research and Markets
(http://www.researchandmarkets.com/research/568dvm/wifi_blasts) has announced the addition of EJL Wireless Research's new report "Wi-Fi Blasts Ahead with 11ac Wave 2 Chipsets" to their offering.
http://photos.prnewswire.com/prnh/20130307/600769
This report provides a comprehensive technical analysis for 802.11ac wave 2 (W2) technology as compared with wave 1 (W1) technology and 802.11n. A detailed access point semiconductor chipset analysis is provided for all vendors.
Features
Detailed analysis of 802.11ac standards
Detailed 802.11ac WiFi access point system block diagrams
Top 9 access point chipset vendor analysis:
- Broadcom Corporation
- Celeno Communications
- Intel Corporation
- Marvell Technology
- MediaTek Inc.
- Qualcomm Technology
- Quantenna Communications
- Realtek Semiconductor
- Redpipe Signals
Key Topics Covered:
EXECUTIVE SUMMARY
RESEARCH METHODOLOGY
CHAPTER 1: EVOLUTION OF THE IEEE 802.11 STANDARDS
- Brief Technical Overview of Gigabit Wi-Fi
- The 802.11g Physical Layer - Wireless Innovation
- 802.11n Physical Layer - Forward-Looking Innovation
- 802.11n Media Access Control Sublayer - Efficiency Reigns
- Familiar 802.11n Enabled Devices - Beginning of the Boom
- IEEE 802.11-2012 - Major Milestone for Wi-Fi
CHAPTER 2: IEEE 802.11AC - THE NEXT GENERATION
- 802.11ac W1 and W2 Capabilities - All About the PHY
- 802.11ac Physical Layer - More Better
- 802.11ac Media Access Control Layer - Optimized
- 5 GHz Band Plan - More Spectrum Opening Up
- Power Levels for Wi-Fi - Going Up
- Coexistence and Compatibility Mechanisms in 802.11ac - Play Nice
- Summary - 802.11n and 802.11ac Differences
- Rate at Range - Convergence at 100 Meters
CHAPTER 3: SYSTEM SOFTWARE IN WI-FI ACCESS POINTS
CHAPTER 4: WI-FI SEMICONDUCTOR CHIPSETS
- Broadcom Corporation's Wi-Fi Products
- Broadcom Access Point Chipsets
- Broadcom Access Point Radios
- Broadcom Wi-Fi Networking Processors
- Broadcom Mobile Device Radios
- Broadcom Wi-Fi Product Summary
- Celeno Communications Wi-Fi Products
- Celeno Access Point Radios
- Celeno Wi-Fi Product Summary
- Intel Corporation's Wi-Fi Products
- Intel Mobile Device Radios
- Intel Wi-Fi Product Summary
- Marvell Technology Group's Wi-Fi Products
- Marvell Access Point Radios
- Marvell Wi-Fi Networking Processors
- Marvell Mobile Device Radios
- Marvell Wi-Fi Product Summary
- MediaTek Inc.'s Wi-Fi Products
- MediaTek Access Point Radios
- MediaTek Wi-Fi Networking Processors
- MediaTek Wi-Fi Product Summary
- Qualcomm Technology Inc.'s Wi-Fi Products
- Qualcomm Access Point Radios
- Qualcomm Wi-Fi Networking Processors
- Qualcomm Mobile Device Radios
- Qualcomm Wi-Fi Product Summary
- Quantenna Communications, Inc.'s Wi-Fi Products
- Quantenna Access Point Radios
- Quantenna Wi-Fi Product Summary
- Realtek Semiconductor Corp.'s Wi-Fi Products
- Realtek Access Point Radios
- Realtek Wi-Fi Networking Processors
- Realtek Wi-Fi Product Summary
- Redpine Signals' Wi-Fi Products
- Redpine Signals Access Point Radios
- Redpine Signals Mobile Device Radios
- Redpine Signals Wi-Fi Product Summary
RESEARCH REPORT FINDINGS
APPENDIX A - REFERENCES
APPENDIX B - ABBREVIATIONS
Companies Mentioned:
- Broadcom Corporation
- Celeno Communications
- Intel Corporation
- Marvell Technology
- MediaTek Inc.
- Qualcomm Technology
- Quantenna Communications
- Realtek Semiconductor
- Redpine Signals
For more information visit http://www.researchandmarkets.com/research/568dvm/wifi_blasts
Media Contact: Laura Wood , +353-1-481-1716, [email protected]
To view the original version on PR Newswire, visit:http://www.prnewswire.com/news-releases/wi-fi-blasts-ahead-with-11ac-wave-2-chipsets-300007590.html
SOURCE Research and Markets
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